Embedded Wiring Board Warpage Control via Simultaneous Reinforcing Layers
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Solution Overview
Problem
The challenge is to manufacture a thinner chip-built-in wiring board while suppressing warpage, which is difficult to achieve with existing laminated structures due to potential warpage issues in thinner designs with higher packing density.
Innovation Solution
A method involving the formation of an insulating layer with a semiconductor chip and wiring, followed by the simultaneous creation of first and second reinforcing layers to sandwich the insulating layer after removing the supporting board, using prepreg material for the reinforcing layers to enhance rigidity and prevent warpage, and employing a stop layer to control the removal process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a board structure is used to suppress warpage, then warpage is reduced, but the board thickness increases and density decreases
Solution Approach 1:
The patent removes the supporting board after forming the insulating layer with embedded semiconductor chips, eliminating the need for a thick board structure while maintaining warpage suppression through the reinforcing layers formed later in the process
Solution Approach 2:
The reinforcing layers are formed after supporting board removal, with their shrinkage during curing uniformly suppressing warpage of the insulating layer from both above and below, achieving thin board design with effective warpage control
2Stability of the object's composition
If reinforcing layers are formed to suppress warpage, then warpage is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent combines the formation of the first and second reinforcing layers into a single simultaneous manufacturing step after supporting board removal, simplifying the process while achieving uniform warpage suppression from both sides of the insulating layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of a thinner, more rigid wiring board with reduced warpage, facilitating a higher density of semiconductor chips and simplifying the manufacturing process by ensuring uniform shrinkage and preventing structural deformation.
Implementation Method 1
In general, a reinforcing layer shows large shrinkage on curing
Data Source
AI summary
A method of manufacturing a wiring board including an insulating layer where a semiconductor chip is embedded includes: forming, on a supporting board, the insulating layer where the semiconductor chip is embedded and a wiring connected to the semiconductor chip; removing the supporting board by etching; and simultaneously forming first and second reinforcing layers so as to sandwich the insulating layer after removing the supporting board.