Embedded Wiring Gutter for Semiconductor Chip Reliability

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Solution Overview

Problem

The wire bonding method for connecting semiconductor chips to insulating base materials faces issues with wire breakage due to high external forces during resin sealing, leading to reliability concerns and high costs due to the use of expensive gold wires, while also limiting wiring density.

Innovation Solution

A method involving a resin coating, laser machining to form a wiring gutter, catalyst deposition, and electroless plating to create a robust wiring connection that is embedded in the gutter, reducing the risk of wire damage and improving adhesive strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wire bonding method is used to connect semiconductor chips to insulating base materials, then electrical connection is achieved, but wire breakage occurs during sealing due to high external forces

Engineering Contradiction:

Improvewire connection reliabilityVSAvoidwire strength during sealing

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The wire bonding process is divided into multiple stages: first forming a bonding pad connection, then creating a protective coating, and finally performing sealing. This segmentation allows the wire to be protected during the sealing process, preventing breakage while maintaining electrical connection reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A protective coating is applied to the wire before the sealing process. This preliminary action protects the wire from high external forces during sealing, preventing breakage while ensuring the wire can withstand the sealing pressure.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If gold wires are used for bonding, then connection reliability is improved, but manufacturing costs increase significantly

Engineering Contradiction:

Improveconnection reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces expensive gold wires with cheaper alternative materials such as copper or aluminum wires. The protective coating compensates for the lower inherent reliability of these cheaper materials, maintaining connection reliability while significantly reducing manufacturing costs.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent uses composite structures combining cheaper wire materials (copper or aluminum) with protective coatings. This composite approach maintains the electrical connection reliability previously achieved with gold while eliminating the high material costs associated with gold wiring.

Inventive Principle:

Principle #40Composite materials

3Strength

If wire diameter is increased to prevent breakage, then wire strength is improved, but wiring density decreases

Engineering Contradiction:

Improvewire strengthVSAvoidwiring density

Core Design Contradiction:

StrengthVSArea of moving object

Solution Approach 1:

A protective coating is applied to thin wires before sealing, enabling them to withstand high external forces during sealing without breaking. This allows the use of thinner wires, thereby maintaining high wiring density while ensuring wire strength during the sealing process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the physical parameters of the wire system by introducing a protective coating layer. This coating alters the mechanical properties of the wire assembly, allowing thin wires to achieve the necessary strength for sealing while maintaining small dimensions for high density.

Inventive Principle:

Principle #35Parameter changes

4Reliability

If molding is performed at extremely high pressure to fill seal material, then sealing is achieved, but wire breakage or damage occurs

Engineering Contradiction:

Improvesealing qualityVSAvoidwire damage from pressure

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A protective coating is applied to the wire before the high-pressure sealing process. This coating acts as a buffer that protects the wire from the harmful effects of extreme pressure during molding, preventing breakage while ensuring proper sealing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The protective coating serves as a cushioning layer that absorbs and distributes the high external forces during sealing. This beforehand cushioning prevents direct transmission of damaging pressure to the wire, maintaining both sealing quality and wire integrity.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances the reliability and durability of the wiring connections by embedding them in a recessed gutter, preventing breakage during resin sealing and allowing for higher wiring density without the need for expensive gold wires.

Implementation Method 1

laser beam machining

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

electroless plating

Methodology Applied

Scientific EffectElectroless plating: Electroplating

Data Source

PatentUS9795033B2Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Publication Date: 2017.10.17 PANASONIC HOLDINGS CORP

AI summary

A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.