Embedded Wiring Package Substrate for Copper Adhesion
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Solution Overview
Problem
Conventional package substrates experience poor adhesion of copper wiring layers, leading to delamination issues due to the wiring layer being formed on insulating layers.
Innovation Solution
The wiring layer is embedded within dielectric layers on the package substrate, with conductive pillars electrically connected to both the wiring and circuit layers, and surface contact pads are formed to enhance adhesion and prevent delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the wiring layer is formed on the insulating layer, then the manufacturing process is simple, but the copper adhesion is poor and delamination occurs
Solution Approach 1:
The wiring layer is embedded within the dielectric layer, creating a nested structure where the copper wiring is surrounded and supported by the dielectric material. This nesting provides mechanical support and improves adhesion while maintaining manufacturing feasibility through sequential layer formation.
Solution Approach 2:
The wiring layer transitions from a surface-level configuration on the insulating layer to an embedded configuration within the dielectric layer. This dimensional change from surface to volume provides enhanced contact area and mechanical interlocking, improving copper adhesion while allowing the process to remain manufacturable.
2Reliability
If the wiring layer is embedded in the dielectric layer, then copper adhesion is improved, but the device structure becomes more complex
Solution Approach 1:
The formation of the wiring layer and dielectric layer is merged into an integrated embedded structure, where the wiring is incorporated within the dielectric during the layer formation process. This merging reduces the need for separate post-processing steps and simplifies the overall device architecture despite the embedded configuration.
Solution Approach 2:
The dielectric layer serves multiple functions: it provides electrical insulation, mechanical support, and adhesion enhancement for the copper wiring layer. This multi-functionality reduces the need for additional specialized layers, thereby reducing overall structural complexity while maintaining improved copper adhesion.
3Quantity of substance
If the wiring layer is embedded in the dielectric layer, then wiring density increases, but manufacturing precision requirements increase
Solution Approach 1:
The dielectric layer is formed first, creating a pre-prepared matrix with defined properties before the wiring layer is embedded. This preliminary action establishes the embedding environment in advance, allowing for controlled integration of the wiring layer and reducing the precision demands during the embedding process itself.
Solution Approach 2:
The physical and chemical parameters of the dielectric layer (such as viscosity, curing temperature, or compositional properties) are optimized to facilitate easy embedding of the wiring layer. By adjusting these parameters, the dielectric material becomes more accommodating to the wiring embedding process, reducing the required manufacturing precision while achieving high wiring density.
Data Source
AI summary
A package substrate is provided, in which dielectric layers are formed on a core board, and a wiring layer is embedded in at least one of the dielectric layers, so that the wiring layer has better copper adhesion to prevent delamination problems. A method of fabricating the package substrate is also provided.