Embedded Wiring in Liquid Jet Head Sealing Plate
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Solution Overview
Problem
The miniaturization of liquid jet heads is hindered by the need to reduce wiring resistance while maintaining the integrity of piezoelectric element deformation, as increasing wiring width or thickness to lower resistance leads to increased sealing plate size and potential inhibition of piezoelectric element deformation.
Innovation Solution
A liquid jet head design where wiring is partially embedded in a wiring plate, allowing for increased cross-sectional area without increasing width or height, and is covered with a metal layer to prevent electrical changes and breakage, with bump electrodes providing reliable connections and uniform power distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the width of the wiring is increased to lower the resistance, then the electrical resistance is reduced, but the wiring region increases and the size of the sealing plate increases
Solution Approach 1:
The wiring is embedded into the sealing plate, transitioning from a surface-level configuration to a three-dimensional structure. This allows the wiring cross-sectional area to be increased (by utilizing the depth dimension through embedding) without increasing the wiring width or sealing plate area, thereby reducing resistance while maintaining compact size
2Reliability
If the thickness of the wiring is increased to lower the resistance, then the electrical resistance is reduced, but the wiring protrudes and inhibits the deformation of the piezoelectric elements
Solution Approach 1:
The wiring is nested within recesses formed in the sealing plate, allowing the wiring to be embedded at the same level as or below the sealing plate surface. This enables the wiring cross-sectional area to be increased for lower resistance while preventing protrusion that would interfere with piezoelectric element deformation
3Manufacturing precision
If the distance between the piezoelectric elements and the sealing plate is increased to prevent wiring interference, then the piezoelectric element deformation is maintained, but the size of the liquid jet head increases
Solution Approach 1:
By embedding the wiring into the sealing plate, the wiring is positioned in the depth dimension rather than protruding in the lateral dimension. This eliminates the need to increase the distance between the piezoelectric elements and sealing plate, maintaining compact liquid jet head size while preventing deformation interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the size of the liquid jet head, maintains piezoelectric element deformation, and enhances the reliability and uniformity of jetting characteristics while lowering manufacturing costs.
Implementation Method 1
When a drive IC (also referred to as a driver IC) supplies voltage signals to the individual electrode layers, the piezoelectric layer deforms in response to the voltage signals to cause changes in pressure in the pressure chambers
Data Source
AI summary
Provided are a liquid jet head with which the size-reduction can be achieved, while the resistance of wiring formed on a wiring plate such as a sealing plate is lowered, and a method for manufacturing the liquid jet head. The liquid jet head includes: a sealing plate having a first surface to which a pressure chamber-forming plate including multiple piezoelectric elements is joined and a second surface which is on a side opposite from the first surface and to which a drive IC that outputs signals for driving the piezoelectric elements is joined, wherein a lower surface-side embedded wire connected to a common wire common to the driving elements are formed on the first surface of the sealing plate, and the lower surface-side embedded wire is at least partially embedded in the sealing plate.