Embedded Wiring Substrate Via Structure Against Layer Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional thin wiring substrates face reliability issues due to the separation of wiring layers from the insulation layer, which affects the overall performance and durability of the substrate.
Innovation Solution
A wiring substrate design that embeds the first wiring layer within the insulation layer and connects it to a second wiring layer through connection vias, with both layers having terminal and embedded portions, enhancing their resistance to separation and improving reliability. The manufacturing method involves etching metal plates, forming projections, and using electrolytic plating to create through holes and connection vias within the insulation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring layers are formed on the surface of the insulation layer, then the manufacturing process is simple, but the wiring layers separate from the insulation layer reducing reliability
Solution Approach 1:
The first wiring layer is embedded within the insulation layer rather than being placed on its surface. This nesting structure prevents separation between the wiring layer and insulation layer, thereby improving reliability while maintaining manufacturing simplicity through a single molding process that forms both the insulation layer and embeds the wiring layer simultaneously.
2Length of stationary object
If the wiring substrate uses thin insulation layer, then the substrate is thinner and more compact, but the separation between wiring layers and insulation layer occurs more easily
Solution Approach 1:
By embedding the first wiring layer within the insulation layer, the design allows for a thinner overall substrate structure while preventing separation issues. The embedded structure ensures that even with reduced insulation layer thickness, the wiring layer remains securely integrated, thus achieving both compactness and reliability.
Solution Approach 2:
The insulation layer is formed with the first wiring layer already embedded within it during the molding process. This preliminary embedding action ensures that the wiring layer is securely positioned before subsequent processing steps, preventing separation even when the insulation layer is made thin to reduce overall substrate thickness.
3Reliability
If conventional wiring layer configuration is used, then manufacturing is easier, but connectivity and anti-separation performance are insufficient
Solution Approach 1:
The first wiring layer is nested within the insulation layer, providing superior connectivity and anti-separation performance. This embedded structure is formed through a single molding process that simultaneously creates the insulation layer and positions the wiring layer, maintaining ease of manufacture while dramatically improving reliability and connectivity.
Solution Approach 2:
The molding process combines the formation of the insulation layer and the embedding of the first wiring layer into a single operation. This merging of processes maintains manufacturing simplicity while achieving the dual benefits of improved connectivity and enhanced anti-separation performance through the embedded structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded wiring layers and connection vias improve the substrate's reliability by preventing separation from the insulation layer, allowing for more robust and durable wiring substrates with enhanced connectivity.
Implementation Method 1
forming an insulation layer in which the first wiring layer and the projection are embedded by pressing the first metal plate and the second metal plate toward the semi-cured resin layer and curing the semi-cured resin layer
Implementation Method 2
forming a connection via connecting the first metal plate and the second metal plate by forming a plating metal in the through hole through electrolytic plating
Data Source
AI summary
A wiring substrate includes an insulation layer, a first wiring layer, and a second wiring layer. The first wiring layer is embedded in the insulation layer with an upper surface of the first wiring layer exposed from the insulation layer. The second wiring layer includes a terminal portion located at a lower position than a lower surface of the insulation layer and an embedded portion embedded in the insulation layer. The wiring substrate further includes a connection via connecting the first wiring layer and the embedded portion. The insulation layer includes an extension between the embedded portion and a lower surface of the first wiring layer. The extension includes a through hole. The connection via is located in the through hole of the extension.