Embedding Known-Good Components Between Carrier Blocks

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Solution Overview

Problem

The challenge lies in reliably embedding and connecting electronic components on component carriers, such as printed circuit boards, while ensuring mechanical robustness and electrical reliability, especially when dealing with complex and valuable components like microprocessors, and efficiently managing heat dissipation with increasingly dense and miniaturized components.

Innovation Solution

A method involving the use of known-good component carrier blocks and components, where components are pre-tested for quality and embedded between two carrier blocks with a formed electrically conductive connection structure, ensuring compliance with predefined criteria through testing and assembly, and utilizing thermal compression bonding for connections without material interfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If components are embedded between component carrier blocks with electrically conductive connection structures, then electrical reliability and signal propagation are improved, but manufacturing complexity and process steps increase

Engineering Contradiction:

Improveelectrical reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The component carrier blocks are pre-tested and classified as known-good before embedding components. The electrically conductive connection structures are formed on the blocks prior to component embedding, ensuring that only verified blocks with functional connection structures are used, thereby guaranteeing electrical reliability while streamlining the manufacturing process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The manufacturing process is divided into separate stages: (1) forming electrically conductive connection structures on component carrier blocks, (2) testing and classifying blocks as known-good, (3) embedding components between verified blocks. This segmentation allows each stage to be optimized independently, improving electrical reliability without proportionally increasing overall manufacturing complexity.

Inventive Principle:

Principle #1Segmentation

2Productivity

If pre-tested known-good components and carrier blocks are used, then product yield and quality are improved, but manufacturing time and resource consumption increase

Engineering Contradiction:

Improvemanufacturing yieldVSAvoidmanufacturing cycle time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

Component carrier blocks and components are pre-tested and classified as known-good before the embedding process. This preliminary quality verification prevents defective items from entering the manufacturing line, significantly improving yield by eliminating rework and scrap, while the pre-classified status accelerates subsequent assembly operations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The testing and classification system is integrated into the manufacturing flow, where component carrier blocks self-verify their quality status through built-in test structures. This self-service approach to quality assurance improves yield without requiring extensive external inspection resources, thereby reducing overall manufacturing time.

Inventive Principle:

Principle #25Self-service

3Strength

If thermal compression bonding is used for connections, then mechanical robustness and electrical reliability are improved, but process temperature and energy consumption increase

Engineering Contradiction:

Improvemechanical robustnessVSAvoidprocess energy consumption

Core Design Contradiction:

StrengthVSUse of energy by stationary object

Solution Approach 1:

The thermal compression bonding process parameters are optimized to use the minimum necessary temperature and pressure to achieve reliable connections. By precisely controlling and adjusting these parameters, the process achieves the required mechanical robustness and electrical reliability while minimizing energy consumption through efficient heat application and reduced process time.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures high-yield, reliable, and efficient manufacturing of component carriers with proper signal propagation and mechanical support, reducing waste and resource loss by using pre-tested components and avoiding material interfaces that could lead to thermal or mechanical issues.

Implementation Method 1

forming an electrically conductive connection structure on and/or in and/or spaced with regard to the first component carrier block

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

utilizing thermal compression bonding for connections without material interfaces

Methodology Applied

Scientific EffectThermal compression bonding: Diffusion Welding

Data Source

PatentUS11184983B2Embedding known-good component between known-good component carrier blocks with late formed electric connection structure

Publication Date: 2021.11.23 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

AI summary

A method of manufacturing a component carrier, wherein the method comprises mounting a known-good component on or spaced with regard to a first known-good component carrier block, thereafter forming an electrically conductive connection structure on and/or in and/or spaced with regard to the first component carrier block, and embedding the component between the first component carrier block and a second known-good component carrier block.