Embedment Layer Elastic Modulus for Substrate Vibration Control
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Solution Overview
Problem
The challenge is to reduce vibration and associated audible noise in electronic component containing substrates, particularly when multilayer ceramic capacitors are embedded, as they can cause distortion leading to substrate vibration and erroneous operation in devices like acceleration sensors.
Innovation Solution
The solution involves optimizing the substrate and embedment layer design by adjusting the thickness, height, and arrangement of electronic components, using a lower elastic modulus embedment layer and incorporating features like recess portions and interposers to cancel out vibrations and reduce sound pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multilayer ceramic capacitors are embedded in the substrate to reduce device thickness, then the substrate thickness is reduced and device compactness is improved, but distortion in the ceramic multilayer body causes substrate vibration and audible noise
Solution Approach 1:
A vibration reduction layer is introduced as an intermediary between the multilayer ceramic capacitor and the substrate. This layer has a lower elastic modulus than both the capacitor and substrate, allowing it to absorb and reduce the distortion vibrations transmitted to the substrate, thereby reducing audible noise while maintaining the embedded structure
Solution Approach 2:
The elastic modulus parameter of the vibration reduction layer is specifically optimized to be lower than both the multilayer ceramic capacitor and the substrate. This parameter change creates a compliant interface that reduces vibration transmission while maintaining structural integrity and device compactness
2Object-generated harmful factors
If the embedment layer is made softer to reduce vibration transmission, then substrate vibration is reduced, but the mechanical strength and support for mounted components may be compromised
Solution Approach 1:
The embedment structure is designed with spatially varying properties: the vibration reduction layer has low elastic modulus where it contacts the capacitor to absorb vibrations, while the embedment layer extending to the substrate surface provides mechanical support. This local differentiation allows simultaneous vibration reduction and structural strength
Solution Approach 2:
The embedment structure combines materials with different elastic moduli - a softer vibration reduction layer for vibration absorption and a harder embedment layer for mechanical support. This composite structure achieves both vibration reduction and adequate mechanical strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively decreases substrate vibration in the audible frequency range, preventing the generation of audible sound and enhancing the reliability of electronic devices by minimizing distortion-induced noise.
Implementation Method 1
distortion produced in ceramic multilayer body 202 vibrates substrate B secured to multilayer ceramic capacitor 201 through connection member S
Implementation Method 2
an embedment layer R formed on one main surface of substrate B so as to embed first electronic component 10. The embedment layer R is lower in elastic modulus than substrate B
Implementation Method 3
distortion in accordance with magnitude of an applied voltage is produced in ceramic multilayer body 202 owing to an electrostriction effect and an inverse piezoelectric effect
Implementation Method 4
distortion in accordance with magnitude of an applied voltage is produced in ceramic multilayer body 202 owing to an electrostriction effect and an inverse piezoelectric effect
Implementation Method 5
incorporating features like recess portions and interposers to cancel out vibrations and reduce sound pressure
Data Source
AI summary
An electronic component containing substrate includes a substrate, a first electronic component mounted on a main surface of the substrate, and an embedment layer provided on the main surface of the substrate and embedding the first electronic component. The first electronic component is a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion and a first side portion and a second side portion between which the layered portion lies and having two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other. The first side portion is located between the layered portion and the main surface of the substrate in a direction of thickness which is a direction perpendicular to the main surface of the substrate. The embedment layer is smaller in elastic modulus than the substrate.