Embossed Double-Wall Cup Assembly With Deeper Insulation Gap

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Solution Overview

Problem

Conventional multi-walled containers require significant surface area contact and adhesive use due to embossments on the outer sleeve, limiting insulation depth and assembly complexity.

Innovation Solution

A compostable container design featuring outwardly projecting embossments on the inner receptacle and inwardly projecting debossments on the outer sleeve, minimizing contact points and creating an intermediate insulating layer through friction fit or adhesive, eliminating the need for excessive adhesives.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If embossments are placed on the outer sleeve to secure it to the inner cup, then the outer sleeve can be attached to the inner cup, but the surface area contact between outer sleeve and inner cup increases significantly, limiting insulation depth

Engineering Contradiction:
Improveattachment reliabilityVSAvoidinsulation layer depth
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent inverts the conventional placement of embossments from the outer sleeve to the inner cup. The inner cup now has outwardly projecting embossments that engage with the outer sleeve, reversing which component carries the embossment features. This inversion allows the outer sleeve to maintain a larger insulating gap while still achieving secure attachment through the embossment engagement points.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent applies local quality by concentrating the attachment function at specific discrete points (the embossments on the inner cup) rather than requiring broad surface area contact. The embossments create localized engagement zones that provide sufficient attachment reliability while leaving the majority of the surface area available for maximizing insulation layer depth.

Inventive Principle:
Principle #3Local quality

2Reliability

If embossments on the outer sleeve are used to secure the outer sleeve to the inner cup, then attachment is achieved, but a significantly higher quantity of adhesive is required

Engineering Contradiction:
Improveattachment reliabilityVSAvoidadhesive quantity
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

By moving the embossments from the outer sleeve to the inner cup, the patent changes which component provides the attachment features. This inversion reduces the adhesive quantity needed because the embossments on the inner cup create mechanical interlocking with the outer sleeve, reducing reliance on adhesive coverage over large surface areas.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent extracts the attachment function from the outer sleeve surface and concentrates it into discrete embossment features on the inner cup. This extraction allows attachment to be achieved through localized mechanical engagement rather than requiring extensive adhesive application across broad surfaces.

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If significant surface area contact is used to secure the outer sleeve to the inner cup, then attachment reliability is improved, but the insulation layer depth is reduced

Engineering Contradiction:
Improveattachment reliabilityVSAvoidinsulation layer depth
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent applies local quality by concentrating attachment at discrete embossment points on the inner cup rather than requiring broad surface contact. These localized engagement zones provide sufficient mechanical interlocking for reliable attachment while preserving the majority of the surface area for maintaining deep insulation layers.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

By inverting the embossment placement to the inner cup, the patent enables attachment reliability to be achieved through localized features that do not compromise the overall insulation layer depth between the inner cup and outer sleeve.

Inventive Principle:
Principle #13The other way round (Inversion)

4Reliability

If embossments on the outer sleeve are used for attachment, then the outer sleeve can be secured to the inner cup, but assembly complexity increases

Engineering Contradiction:
Improveattachment reliabilityVSAvoidassembly complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent simplifies assembly by inverting the embossment placement to the inner cup, which is already formed during the inner cup manufacturing process. This eliminates the need for separate embossment formation operations on the outer sleeve and reduces assembly steps, while still achieving reliable attachment through the embossment engagement features.

Inventive Principle:
Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances insulation quality and simplifies assembly while maintaining recyclability by reducing surface area contact and adhesive reliance.

Implementation Method 1

an intermediate insulating layer defined between the receptacle and outer sleeve for insulating the container

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

The outer sleeve can be secured to the receptacle by way of friction fit

Methodology Applied
Scientific EffectFriction: Friction

Data Source

PatentUS20260062168A1Embossed double wall cup
Publication Date: 2026.03.05 HUHTAMAKI INC
  • US20260062168A1 patent drawing
  • US20260062168A1 patent drawing
  • US20260062168A1 patent drawing

AI summary

A multi-walled container comprising a receptacle, and outer sleeve, and an intermediate space defined therebetween for insulating the container is provided. The receptacle includes a bottom wall and a circumferential sidewall, the receptacle sidewall including at least one outwardly projecting embossment spaced below an upper edge of the receptacle. The outer sleeve has a circumferential sidewall which may include at least one inwardly projecting debossment. The at least one outwardly projecting embossment contacts and engages the at least one inwardly projecting debossment of the receptacle to define an intermediate insulating layer between the receptacle sidewall and outer sleeve sidewall and secure the outer sleeve to the receptacle.