Embossed Electronic Device Casing for Lightweight Structural Strength
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Solution Overview
Problem
Existing server casings face challenges in achieving lightweight and carbon reduction requirements while maintaining structural strength, particularly in supporting electronic components without deformation.
Innovation Solution
The implementation of embossing structures on a first plate within the server casing, which increases the average moment of inertia of cross sections, enhancing structural strength and reducing material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the bottom plate thickness is increased to ensure structural strength and prevent deformation, then the structural strength is improved, but the weight and carbon usage increase
Solution Approach 1:
The patent applies embossing structures at specific locations on the bottom plate to locally enhance structural strength. Instead of uniformly increasing the entire plate thickness, the embossing patterns concentrate material reinforcement where needed, creating variable thickness regions that provide enhanced stiffness and strength while minimizing overall material usage and weight reduction.
Solution Approach 2:
The patent modifies the geometric parameters of the bottom plate by introducing embossing structures with specific patterns and depths. These parameter changes alter the moment of inertia and section modulus of the plate, improving structural strength without requiring a uniform thickness increase. The embossing parameters (depth, width, spacing) are optimized to achieve the required strength while minimizing material consumption.
2Strength
If the bottom plate thickness is increased to ensure structural strength and prevent deformation, then the structural strength is improved, but the material usage increases
Solution Approach 1:
The embossing structures are strategically positioned and dimensioned to provide localized reinforcement only where structural strength is required. This local quality approach allows the bottom plate to use material efficiently, concentrating it in regions with high stress or deformation risk while maintaining lighter weight in lower-risk areas, thereby reducing overall material usage while meeting strength requirements.
Solution Approach 2:
By changing the geometric parameters through embossing (creating recesses and protrusions), the patent optimizes the distribution of material within the plate. This parameter modification allows the same amount of material to be arranged in a configuration that maximizes structural strength, effectively using material more efficiently than a uniform thickness design would allow.
Data Source
AI summary
An electronic device casing includes a first plate and two second plates. The first plate includes at least one embossing structure. Times of an average moment of inertia of cross sections of the first plate in a first direction are not smaller than 1.14. The two second plates are connected to the first plate and form an accommodation space with the first plate.