Embossed Film Mask Structure for Uniform Roll-to-Roll Patterning
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Solution Overview
Problem
Existing film mask-based roll-to-roll photolithography technologies face issues with adhesive force, resolution, and mechanical defects leading to mura and non-uniform thickness during patterning, particularly in roll-to-roll exposure processes using dry film resist and mechanical reinforcement methods.
Innovation Solution
A film mask with a transparent substrate, darkened light-shielding pattern layer, and embossed pattern part, featuring varying metal layer thicknesses or direct contact regions, along with additional layers for attachment and release force enhancement, to maintain uniform thickness and reduce mura during roll-to-roll patterning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a lamination process is introduced to maximize adhesive force of film mask to substrate, then adhesive force is improved, but machining tolerance and deformation cause difficulty in maintaining exact tolerance
Solution Approach 1:
The film mask is pre-laminated to the substrate before the actual patterning process. This preliminary lamination ensures that the film mask is firmly attached and positioned correctly on the substrate, preventing deviation during subsequent processing steps while maintaining patterning tolerance through controlled lamination parameters
Solution Approach 2:
The lamination process parameters such as pressure, temperature, and speed are precisely controlled and optimized to achieve the right balance between adhesive force and patterning tolerance. By adjusting these parameters, the system maximizes attachment strength while minimizing deformation and maintaining exact tolerance requirements
2Strength
If dry film resist is warmed to near 100°C for lamination, then adhesive force is improved, but resolution capability deteriorates due to inherent DFR resolution problems
Solution Approach 1:
The warming temperature of the dry film resist is precisely controlled to near 100°C during lamination. This temperature optimization provides sufficient adhesive force for proper attachment while being carefully managed to avoid excessive thermal effects that would degrade the resolution capability of the DFR material
3Stability of the object's composition
If mechanical reinforcement is conducted using crown roll or edge polishing, then roll deformation is reduced, but local deformation still occurs due to fluid characteristics of photosensitive resin
Solution Approach 1:
The film mask incorporates regions with different metal layer thicknesses or direct contact regions between the transparent substrate and darkened light-shielding pattern layer. This creates local variations in mechanical properties and contact characteristics that compensate for local deformations caused by the fluid characteristics of the photosensitive resin, ensuring uniform pattern formation across the entire substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The film mask effectively reduces mura and maintains uniform thickness despite mechanical defects, ensuring high-resolution patterns with consistent thickness across the roll-to-roll process.
Implementation Method 1
a metal layer provided between the transparent substrate and the darkened light-shielding pattern layer is provided, wherein the film mask includes two or more regions of the metal layer having different thicknesses from each other or two or more regions of the darkened light-shielding pattern layer having different thicknesses from each other
Implementation Method 2
an embossed pattern part provided on a surface of the transparent substrate, on which the darkened light-shielding pattern layer is provided
Implementation Method 3
a darkened light-shielding pattern layer provided on the transparent substrate
Implementation Method 4
a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate
Implementation Method 5
additional layers for attachment and release force enhancement
Data Source
Figure 1
Figure 2~3
Figure 4(a)~4(c)
AI summary
The present application relates to a film mask comprising: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and an embossed pattern part provided on a surface of the transparent substrate, which is provided with the darkened light-shielding pattern layer, a method for manufacturing the same, a method for forming a pattern by using the same, and a pattern formed by using the same.