Embossed Flex Circuit Interconnects for Print Head Jet Density
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Solution Overview
Problem
Current print head designs face challenges in achieving high jet packing density and jet count due to difficulties in manufacturing reliable and cost-effective electromechanical interconnects between actuators and drive electronics, particularly at reduced sizes and increased densities.
Innovation Solution
The use of embossed flex circuits with contact pads extending out of the plane of the flexible substrate, combined with anisotropic conductive film, conductive adhesive, or nonconductive adhesive to form robust interconnects between the transducer array and drive circuitry, allowing for increased density and reduced spacing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chip on flex (COF) and tape automated bonding (TAB) technologies are used for interconnect, then the interconnect between drive circuitry and transducers can be achieved, but the manufacturing cost increases and the capability to achieve manufacturable and reliable interconnects at increased density and reduced sizes is limited
Solution Approach 1:
The patent extracts the interconnect function from complex COF/TAB assemblies and implements it through simple embossed contact pads on a flexible substrate. The embossed features directly engage with transducer elements, eliminating the need for separate bonding processes and reducing manufacturing steps while maintaining reliability.
Solution Approach 2:
The patent employs a cost-effective flexible substrate with embossed contact pads instead of expensive COF/TAB technologies. The embossed features are formed through simple molding or embossing processes, making the interconnect solution economically viable for high-volume production while achieving the required reliability.
2Productivity
If jet packing density and jet count are increased, then higher resolution and higher quality print images are achieved, but the size and spacing between actuators, electrical traces, and electromechanical interconnects must be significantly reduced
Solution Approach 1:
The patent utilizes the third dimension by creating embossed contact pads that extend vertically from the flexible substrate surface. This vertical engagement allows for compact horizontal spacing while maintaining reliable electrical connection, enabling higher jet density without compromising interconnect performance.
Solution Approach 2:
The patent employs a flexible substrate that can accommodate high-density actuator arrays through its inherent flexibility. The thin film structure allows for reduced spacing between elements while maintaining mechanical integrity and electrical connectivity, supporting increased jet packing density.
3Reliability
If the interconnect between drive circuitry and transducers is made robust and reliable, then higher jet densities and counts can be supported, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the electrical connection function with the mechanical support structure by integrating embossed contact pads directly into the flexible substrate. This consolidation eliminates separate interconnect components and assembly steps, reducing manufacturing complexity while ensuring robust electrical connection between drive circuitry and transducers.
Solution Approach 2:
The embossed contact pads are formed through self-aligned processes during substrate manufacturing, eliminating the need for separate alignment and bonding operations. The structure automatically provides both mechanical support and electrical connection, reducing manufacturing steps and complexity while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of robust and reliable interconnects that support higher jet densities and counts, improving print head performance while reducing manufacturing costs and complexity.
Implementation Method 1
an array of embossed flex circuits with contact pads extending out of the plane of the flexible substrate are formed and connected to an array of transducer elements through an anisotropic conductive film
Implementation Method 2
connected to an array of transducer elements through an anisotropic conductive film, conductive adhesive
Implementation Method 3
anisotropic conductive film, conductive adhesive, or nonconductive adhesive to form robust interconnects
Data Source
AI summary
A method of manufacturing a print head includes forming a jet stack having an array of jets, arranging an array of transducers on the jet stack such that each transducer in the array of transducers corresponds to each jet in the array of jets, embossing a flexible circuit substrate having contact pads such that the contact pads extend out of a plane of the flexible circuit substrate, and arranging the flexible circuit substrate such that the contact pads electrically connect to at least some of the transducers in the array of transducers.