Embossed Sheet-Metal Groove Layout for Constant Solder Gaps
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Solution Overview
Problem
Existing embossing methods for sheet metal parts result in non-constant soldering or adhesive gaps due to material flow during embossing, which hinders reliable bonding.
Innovation Solution
The method involves embossing a support groove and a functional groove in the sheet metal part, with the support grooves reducing material flow and ensuring a constant, parallel gap for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If embossing pressure is applied to form a groove in sheet metal, then the groove is formed for receiving a second component, but material flows transversely causing non-constant soldering gaps
Solution Approach 1:
The embossing process is segmented into multiple stages: first embossing the support groove to create a material barrier, then embossing the functional groove. This segmentation prevents material flow during functional groove formation, ensuring parallel side walls and constant soldering gaps for reliable bonding.
Solution Approach 2:
The support groove is embossed in advance before the functional groove. This preliminary action creates a material barrier that prevents transverse material flow during subsequent functional groove embossing, thereby ensuring the groove forms with parallel side walls and constant gap dimensions.
2Manufacturing precision
If support grooves are embossed to reduce material flow, then soldering gap constancy is improved, but device complexity increases
Solution Approach 1:
The support groove and functional groove embossing are combined into a single integrated embossing tool with multiple embossing elements. This allows both grooves to be formed in one operation, achieving constant soldering gaps without significantly increasing device complexity or production time.
Solution Approach 2:
The embossing tool is designed with multi-functionality, incorporating both support groove embossing elements and functional groove embossing elements in a single device. This universal tool performs multiple functions simultaneously, avoiding the need for separate embossing operations and reducing overall process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a reliable substance-to-substance bond by maintaining a constant, optimized soldering or adhesive gap, enhancing the capillary effect and overall bonding efficiency.
Implementation Method 1
at least one support groove is inserted and/or introduced in the surrounding area of a functional groove, so as to reduce a flowing of a material portion of a component transversely to the direction of action of the embossing pressure
Implementation Method 2
A soldering of the sheet metal part to the second component is carried out subsequently, wherein a soldering agent is introduced in a soldering gap between the embossed groove of the sheet metal part and the second component
Data Source
AI summary
A device, e.g., a heat exchanger, is disclosed. The device includes a first component and a second component. The first component has at least a first surface portion and a second surface portion. The first surface portion and the second surface portion are located opposite to one another and are spaced apart from one another. The first component includes a first support groove provided at the first surface portion and a functional groove provided at the first surface portion. The functional groove is arranged spaced apart from the first support groove at least in some sections. The functional groove is structured and arranged for partially receiving a second component for a substance-to-substance bond.