Embossed Component Grooves for Consistent Soldering Gaps
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing embossing methods for sheet metal parts result in non-constant soldering or adhesive gaps due to material flow during the embossing process, leading to unreliable bonding.
Innovation Solution
The introduction of support grooves alongside functional grooves in the embossing process reduces material flow parallel to the embossing direction, creating consistently aligned and parallel side walls for a reliable substance-to-substance bond, optimizing the design for soldering or adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If embossing pressure is applied to form a groove in sheet metal, then the groove is formed for receiving a second component, but material flows transversely to the embossing direction causing non-constant soldering gaps
Solution Approach 1:
The embossing process is segmented into multiple stages: first embossing support grooves to create material flow barriers, then embossing the functional groove between them. This segmentation prevents transverse material flow during functional groove formation, ensuring parallel side walls and constant soldering gaps for reliable substance-to-substance bonding.
2Manufacturing precision
If support grooves are embossed to reduce material flow, then soldering gap consistency is improved, but the embossing process complexity increases
Solution Approach 1:
Multiple grooves (support grooves and functional groove) are embossed in a single embossing operation using a multi-component embossing tool. The support grooves and functional groove are formed simultaneously in one pressing action, avoiding multiple separate embossing steps and reducing overall process complexity despite the increased tool design requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a consistent soldering or adhesive gap, enhancing the capillary effect and reliability of the bonding process by minimizing material flow and maintaining parallelism of side walls, thereby improving the mechanical resistance and tolerance compensation.
Implementation Method 1
A flowing of a material portion of the component parallel to the first surface portion or a flowing of the material portion parallel to a surface expansion direction of the first surface portion, respectively, can be reduced during the embossing of the functional groove by means of the first support groove
Implementation Method 2
a soldering of the sheet metal part to the second component is carried out subsequently, wherein a soldering agent is introduced in a soldering gap between the embossed groove of the sheet metal part and the second component
Data Source
AI summary
The present disclosure concerns a method for embossing a component, a method for connecting a component to a second component via a substance-to-substance bond, and a device, e.g., a heat exchanger, having such a component. The method for embossing includes embossing a support groove into the component at least in some sections at a first surface portion of the component; embossing a functional groove into the component at the first surface portion; wherein the functional groove is arranged spaced apart from the support groove at least in some sections; and wherein the functional groove is formed for partially receiving a second component for a substance-to-substance bond.