Embossed Heat Transfer Labels Using UV-Curable Ink Printing

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Solution Overview

Problem

Existing embossed heat transfer labels require a costly embossing process and are limited in customization, as they rely on pre-embossed carriers, which increase production costs and hinder flexibility in design variations.

Innovation Solution

The method involves printing an embossing layer with a cross-linkable polymer ink on a carrier, followed by a design layer using another cross-linkable polymer ink, which separates and transfers to a target object during a heat transfer process, eliminating the need for pre-embossing and allowing for customizable embossing patterns without additional tooling costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a pre-embossed carrier is used to produce textured heat transfer labels, then the embossed pattern can be transferred to the target object, but the production cost increases due to embossing tooling and additional production steps

Engineering Contradiction:
Improveembossed pattern transferVSAvoidproduction cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces the physical embossing process with a printed embossing layer that copies the embossed pattern appearance. Instead of mechanically embossing the carrier, a design layer is printed with embossing pattern information that is then transferred to the target object during the heat transfer process, eliminating the need for expensive embossing tooling while maintaining the visual and tactile embossed effect

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent substitutes the mechanical embossing system with a printing and heat transfer system. The embossed pattern is created through printing the design layer with specific patterns and then transferring it via heat and pressure, replacing the traditional mechanical embossing die and press system with a more flexible and cost-effective printing-based approach

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If a pre-embossed carrier is used for heat transfer labels, then consistent embossed patterns can be achieved, but customization flexibility is reduced

Engineering Contradiction:
Improvepattern consistencyVSAvoidcustomization flexibility
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent introduces dynamic flexibility by replacing the static embossed carrier with a printable design layer. The design layer can be digitally programmed with different embossing patterns, allowing the system to adapt to various customization requirements without physical retooling. The heat transfer process dynamically transfers the printed embossing pattern to the target object, enabling both consistency and flexibility

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent enables customization by changing the digital parameters of the printed design layer rather than physically changing the carrier. Different embossing patterns, textures, and designs can be achieved by modifying the print file parameters, allowing rapid customization while maintaining production efficiency and pattern consistency through digital control

Inventive Principle:
Principle #35Parameter changes

3Productivity

If traditional thermoplastic ink systems are used for heat transfer labels, then the labeling process can be completed, but volatile organic compounds are emitted and abrasion resistance is reduced

Engineering Contradiction:
Improvelabeling process completionVSAvoidvolatile organic compounds emission
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent changes the chemical composition parameter of the ink system from traditional thermoplastic inks to UV-curable inks. This parameter change eliminates volatile organic compounds by using a photopolymerization curing mechanism instead of thermal curing, and simultaneously improves abrasion resistance through the formation of a cross-linked polymer network structure that provides enhanced durability

Inventive Principle:
Principle #35Parameter changes

4Productivity

If traditional thermoplastic ink systems are used for heat transfer labels, then the labeling process can be completed, but chemical resistance is reduced

Engineering Contradiction:
Improvelabeling process completionVSAvoidchemical resistance
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent uses UV-curable inks that form a composite cross-linked polymer structure after UV exposure. This composite material structure, created through photopolymerization of multiple reactive components, provides superior chemical resistance compared to traditional thermoplastic inks, while maintaining the ability to complete the labeling process efficiently

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies production, reduces costs, and enables high customization and durability of embossed heat transfer labels with improved wash-fastness and repeatability, while maintaining the embossed pattern on the target object.

Implementation Method 1

UV curing heat transfer labels can provide advantages over solvent-based or water-based thermoplastic ink systems since they do not emit volatile organic compounds and they exhibit improved abrasion resistance and chemical resistance

Methodology Applied
Scientific EffectUV curing: Photopolymerisation

Implementation Method 2

heat transfer labels are used to transfer indicia onto fabrics and other substrates. Typically, heat transfer labels include thermoplastic color layers capable of being adhered to substrates upon application of heat and pressure

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentEP3218205B1Method of making embossed heat transfer labels
Publication Date: 2024.01.03 ILLINOIS TOOL WORKS INC
  • EP3218205B1 patent drawingFigure 1~2
  • EP3218205B1 patent drawingFigure 3
  • EP3218205B1 patent drawingFigure 4~6

AI summary

An embossed heat transfer label includes a carrier (12), embossing layer (14), release coating (16), design layer (18), and adhesive layer (20), in which the embossing layer is formed to include an embossing pattern, and the design layer is configured to take up the embossing pattern from the embossing layer. The embossed heat transfer label is configured such that the design layer and the adhesive layer transfer to a target object upon application of heat and pressure, while the embossing layer and the release coating is removed and disposed with the carrier. The exposed design layer provides an embossed surface on the target object. The label can alternatively include a profile layer having a first surface for taking up the embossing pattern from the embossing layer and a second, flat, surface on which the design layer is printed.