Embossed Multi-Protrusion Heater for Uniform Substrate Heating
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in uniformly heating substrates due to thermal strain, which can lead to temperature disparities and inefficient deposition processes.
Innovation Solution
The substrate processing apparatus features a heater with a body, first, second, and third protrusion portions, and embossings that contract uniformly when heated, ensuring the center and outer regions of the heater contact the substrate, maintaining uniform temperature and reducing friction through rounded edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional heater is used to heat the substrate, then the substrate can be heated, but thermal strain causes non-uniform temperature distribution and contact issues
Solution Approach 1:
The heater is divided into multiple protrusion portions (first, second, third protrusions) with different heights, creating segmented contact zones. This segmentation allows each region to compensate for thermal strain independently, ensuring uniform temperature distribution and reliable contact across the entire substrate surface during heating.
Solution Approach 2:
The heater structure incorporates protrusion portions with varying heights (different geometric parameters) to compensate for thermal expansion/contraction. By changing the height parameter of different heater regions, the patent maintains optimal contact pressure and temperature uniformity despite thermal strain during heating operations.
2Productivity
If the heater contacts the substrate directly, then heating efficiency improves, but friction and particle generation increase
Solution Approach 1:
The protrusion portions of the heater have rounded top surfaces instead of sharp edges. This curvature reduces friction between the heater and substrate during contact, minimizing mechanical stress and particle generation while maintaining effective thermal coupling for efficient heating.
3Ease of manufacture
If the heater structure is simplified, then manufacturing is easier, but temperature control precision decreases
Solution Approach 1:
The heater incorporates protrusion portions with different heights at different locations, creating local quality variations. This allows precise temperature control in specific regions (center vs. outer regions) while maintaining overall structural simplicity that facilitates manufacturing. Each local region is optimized for its specific thermal requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for uniform heating of substrates, reducing temperature differences and particle density on the substrate surface, enhancing deposition process efficiency and material uniformity.
Implementation Method 1
a heater provided in the process chamber to support a lower surface of the substrate and configured to heat the substrate
Implementation Method 2
configured to heat the substrate
Implementation Method 3
a microwave application unit configured to excite the processing gas to plasma
Data Source
AI summary
A substrate processing apparatus includes a processing chamber including a processing space where a substrate is processed and a heater provided in the process chamber to support the substrate and configured to heat the substrate, wherein the heater includes a body, a first protrusion portion protruding upward in a vertical direction from a center of the body, and a second protrusion portion protruding upward from a center of the first protrusion portion, first embossings are formed in a region which does not overlap the first protrusion portion in a vertical direction on an upper surface of the body, second embossings are formed in a region which does not overlap the second protrusion portion in a vertical direction on an upper surface of the first protrusion portion, and third embossings are formed on an upper surface of the second protrusion portion.