Embossed Conductive Splitter Assembly for High-Power Connectors
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Solution Overview
Problem
Existing electrical splitters require complex and time-consuming manual assembly processes, leading to increased costs and risks of over-molding and human error. Additionally, conventional splitters using printed circuit boards can generate high temperatures during high power distribution, making them less suitable.
Innovation Solution
A splitter design featuring a thin, solid electrically conductive layer with protruding terminals arranged in a specific pattern to provide electrical connections between connectors. The layer may have a rectangular or circular shape and can include embosses to enhance stiffness and resiliency, reducing the risk of bending and improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If printed circuit boards are used for bridging connections, then electrical connection is provided, but manufacturing cost increases and assembly time is extended
Solution Approach 1:
The circuit board is segmented into a modular assembly where the circuit board itself is separated from the housing. The circuit board can be pre-assembled and tested independently, then integrated into the final housing assembly. This segmentation allows parallel manufacturing processes and reduces the critical path of assembly operations.
Solution Approach 2:
The circuit board assembly is merged with the housing through overmolding, combining multiple components (circuit board, connectors, housing) into a single integrated assembly. This merging eliminates separate assembly steps for securing the circuit board to the housing and reduces the total number of parts and assembly operations required.
2Reliability
If printed circuit boards are used for bridging connections, then electrical connection is provided, but manufacturing complexity increases
Solution Approach 1:
The circuit board assembly is merged with the housing through overmolding, combining multiple components (circuit board, connectors, housing) into a single integrated assembly. This merging eliminates separate assembly steps for securing the circuit board to the housing and reduces the total number of parts and assembly operations required.
Solution Approach 2:
The overmolding process automatically secures the circuit board assembly to the housing without requiring additional fasteners, adhesives, or separate mounting operations. The molding material itself serves as the securing mechanism, eliminating the need for separate fastening steps and reducing assembly complexity.
3Power
If conventional splitters are used for high power distribution, then electrical connection is provided, but temperature increases excessively
Solution Approach 1:
The circuit board is extracted from the housing assembly and overmolded separately, allowing for optimized thermal management. The molding material acts as a thermal barrier and insulator, protecting sensitive circuit board components from excessive heat generated during high power distribution while maintaining electrical connectivity.
Solution Approach 2:
The assembly uses composite construction combining the circuit board material with the overmolding material. This composite structure provides both electrical conductivity where needed and thermal insulation where required, managing heat distribution across the assembly during high power operation.
Data Source
AI summary
A splitter for interconnecting a first connector with at least two second connectors includes a first electrically conductive layer that is connectable to the first connector and to at least one of the second connectors. The first layer has at least two electrically conductive terminals which protrude from the first layer. The electrically conductive terminals are arranged to provide electrical connection between a first contact of the first connector and an associated first contact of at least one of the second connectors.