Embossed Vacuum Wafer Holder for Thin Cassette Handling
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Solution Overview
Problem
Existing end effectors for handling semiconductor wafers and microelectronic substrates are complex to produce and assemble, have a high overall thickness for mechanical stability, and risk damaging adjacent workpieces due to insufficient clearance when inserted into tightly spaced cassettes.
Innovation Solution
A holding device with a vacuum system integrated into a fork-shaped design, featuring embossed supply lines that form bead-like vacuum channels, allowing for a thin and rigid structure that avoids contact with adjacent workpieces while providing sufficient mechanical stability and secure handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum channels are created by material removal (milling or punching), then the vacuum circuit can be closed, but the overall thickness increases and mechanical stability is compromised
Solution Approach 1:
The patent uses a thin film element (0.05-0.5mm thick) with embossed vacuum channels instead of thick solid structures. The film is stretched over a support structure to form a closed vacuum circuit, achieving both vacuum sealing and thin overall dimensions. This resolves the contradiction by using flexible thin films rather than rigid thick structures for creating vacuum channels.
Solution Approach 2:
The patent transitions from creating vacuum channels through material removal in the thickness direction to forming embossed channels on the surface of a thin film. The vacuum channels are created by embossing (raising) the film surface rather than removing material, allowing the film to maintain minimal thickness while still forming closed vacuum circuits when stretched over the support structure.
2Strength
If material thickness is increased to ensure mechanical stability, then structural rigidity is achieved, but the overall thickness becomes too large for safe handling in cassettes
Solution Approach 1:
The patent divides the holding device into two functional parts: a thin film element (0.05-0.5mm) providing vacuum functionality and a separate support structure providing mechanical stability. This segmentation allows each component to be optimized independently - the film remains thin for safe cassette handling while the support structure provides necessary rigidity.
Solution Approach 2:
The patent creates a composite structure combining a thin film material (e.g., stainless steel, aluminum, or plastic) with a support structure (frame, grid, or lattice). This composite design achieves mechanical stability through the support structure while maintaining thin overall thickness through the thin film, resolving the contradiction between strength and thickness.
3Reliability
If multiple layers are used to create vacuum channels, then vacuum sealing is achieved, but production and assembly complexity increases
Solution Approach 1:
The patent merges the vacuum channel formation and vacuum sealing functions into a single thin film element with embossed channels. When this single element is stretched over the support structure, the embossed channels automatically form closed vacuum circuits, eliminating the need for multiple separate layers and complex assembly procedures required by prior art.
Solution Approach 2:
The vacuum channels are pre-formed (embossed) on the thin film element during manufacturing. This preliminary action creates the vacuum circuit geometry in advance, so that when the film is stretched over the support structure, the vacuum sealing is automatically achieved without requiring additional assembly steps to create or seal the channels.
4Object-affected harmful factors
If the holding device is made thin to avoid contact with adjacent workpieces, then damage risk is reduced, but mechanical stability decreases
Solution Approach 1:
The patent segments the holding device into a thin film element for vacuum contact and a separate support structure for mechanical strength. This allows the film to be thin (reducing damage risk to adjacent workpieces) while the support structure provides the necessary mechanical stability, resolving the contradiction between thinness and strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves safe and reliable handling of workpieces with a low overall thickness, ensuring mechanical stability and preventing damage to adjacent components, while simplifying production and assembly processes.
Implementation Method 1
a vacuum device (10) for holding and/or transporting the workpieces (2)
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
The invention relates to a holding device (3) for holding and/or transporting workpieces (2) and/or components, in particular, for example, wafers for semiconductor technology. It is proposed that a vacuum device (10) is included for holding and/or transporting the workpieces (2) and/or components, wherein the holding device (3) is designed in two parts, comprising two substantially parallel, in particular sheet-metal-shaped, sub-elements (4, 5), wherein supply lines (11) with end-facing suction openings (12) are provided to form the vacuum device (10), such that a vacuum can be created between the holding device (3) and the workpiece (2) and/or component, wherein the supply lines (11) are formed by an embossing process in at least one of the sub-elements (4, 5).Optionally, the embossed supply lines (11) and intake openings (12) are designed with embossed structures such that suction elements (16) can be inserted into the intake openings (12) without tools. Furthermore, the invention relates to a method for holding and/or transporting workpieces (2) and/or components, particularly in semiconductor technology, comprising in particular a proposed holding device (3).