Embossing Die Orientation for Defect-Free Nanostructure Filling

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Solution Overview

Problem

Current embossing technologies face challenges such as incomplete distribution and filling of embossing material, leading to gas bubbles, unevenness, and asymmetry, particularly in the production of nanometer and micrometer-scale structures, which can result in defects like chromatic and spherical aberrations in optical products.

Innovation Solution

The method involves dispensing embossing material against the force of gravity, aligning the dispensing direction against gravity, and orienting embossing structures parallel to the gravitational direction to prevent gas inclusions and ensure self-assembly, symmetrical distribution, and controlled hardening of the material, using a combination of gravitational forces, adhesion, and curvature to prevent lateral flow and achieve uniform embossing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If embossing material is dispensed horizontally or with gravity assistance, then dispensing efficiency is improved, but gas bubbles and incomplete filling occur

Engineering Contradiction:

Improvedispensing efficiencyVSAvoidfilling completeness

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent inverts the conventional dispensing approach by orienting the dispensing direction vertically against gravity rather than horizontally with gravity. The embossing structure is rotated 90 degrees so that the opening faces upward, and embossing material is dispensed from below against the gravitational force. This inversion eliminates gas bubble formation and ensures complete filling while maintaining high dispensing efficiency.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent changes the orientation parameter of the embossing structure from horizontal to vertical, and changes the dispensing direction from horizontal to vertical upward. By modifying these geometric parameters, the patent resolves the contradiction between dispensing efficiency and filling completeness, achieving both goals simultaneously.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If embossing structures are small for high precision, then manufacturing precision is improved, but material distribution uniformity worsens

Engineering Contradiction:

Improvestructure precisionVSAvoidmaterial distribution uniformity

Core Design Contradiction:

Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

By inverting the embossing structure orientation and dispensing direction, the patent achieves uniform material distribution even in small, high-precision structures. The vertical upward dispensing against gravity ensures consistent material flow and complete filling of fine features, resolving the contradiction between small size/precision and material uniformity.

Inventive Principle:

Principle #13The other way round (Inversion)

3Device complexity

If conventional embossing is used, then process simplicity is maintained, but product quality deteriorates due to defects

Engineering Contradiction:

Improveprocess simplicityVSAvoidproduct quality

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The patent applies a simple 90-degree rotation of the embossing structure and changes the dispensing direction to vertical upward. This minimal modification to the conventional process eliminates gas bubbles and filling defects, significantly improving product quality while maintaining process simplicity. The inversion approach achieves high quality without complex additional equipment or steps.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables defect-free, efficient, and cost-effective distribution of embossing material, preventing gas inclusions and ensuring symmetrical, uniform embossing, which enhances the quality of nanometer and micrometer-scale structures, particularly in lens production, by maintaining material homogeneity and preventing deformation.

Implementation Method 1

dispensing an embossing material in embossing structures of an embossing die against the force of gravity, in particular by aligning the dispensing direction of a metering device against the force of gravity

Methodology Applied

Scientific EffectGravitation: Gravitation

Implementation Method 2

the prevailing adhesion between carrier substrate and embossing material is too great for this purpose

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS10088746B2Method and device for embossing structures

Publication Date: 2018.10.02 EV GRP E THALLNER GMBH

AI summary

A method for embossing at least one microstructure or nanostructure with an embossing die that has at least one embossing structure with the following steps, in particular the following sequence: aligning the embossing structure of the embossing die relative to a metering device, metering an embossing material in the embossing structure by means of the metering device, at least partial hardening of the embossing material and embossing of the embossing material, characterized in that the embossing structures point in a gravitational direction (G) at least in the case of the metering. In addition, the invention relates to a corresponding device.