EMC Coated Image Sensor Package for Interference Reduction
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Solution Overview
Problem
Conventional metal cases used for electromagnetic compatibility (EMC) in digital cameras are bulky and difficult to rework, leading to increased production costs and lower yields due to challenges in assembling and reprocessing image sensor modules.
Innovation Solution
An electronic device package with a chip scale package, optical elements, and an encapsulation featuring a non-conductive electromagnetic compatibility (EMC) coating, including an electromagnetic absorption layer and a partial reflection layer, to prevent electromagnetic interference and scattering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If metal cases are used for EMC shielding, then electromagnetic interference is prevented, but the device occupies more space and becomes difficult to rework
Solution Approach 1:
The patent replaces the mechanical metal case structure with a non-conductive encapsulation material that has integrated EMC coating. This substitution eliminates the need for separate metal shielding components while maintaining electromagnetic interference prevention, thereby reducing package space and simplifying the overall structure.
Solution Approach 2:
The patent uses composite materials consisting of non-conductive encapsulation material combined with EMC coating layers. This composite structure provides both mechanical protection and electromagnetic shielding in a single integrated component, avoiding the need for separate metal cases and reducing overall package volume.
2Object-affected harmful factors
If metal cases are used for EMC shielding, then electromagnetic interference is prevented, but reworking and reprocessing become difficult
Solution Approach 1:
The patent replaces the mechanical metal case with a non-conductive encapsulation material that can be more easily modified and reworked. This substitution allows for simpler reprocessing procedures when assembly errors occur, improving ease of repair while maintaining EMC shielding effectiveness through the integrated coating.
Solution Approach 2:
The patent changes the material parameter from conductive metal to non-conductive encapsulation material with EMC coating. This parameter change enables easier reworking and reprocessing while maintaining the electromagnetic interference prevention function, as the non-conductive material can be more readily modified without the constraints of metalworking.
3Object-affected harmful factors
If metal cases are used for EMC shielding, then electromagnetic interference is prevented, but production costs increase
Solution Approach 1:
The patent merges the EMC shielding function with the encapsulation structure by integrating EMC coating directly onto the non-conductive encapsulation material. This merging eliminates the need for separate metal case components and assembly steps, thereby reducing production complexity and cost while maintaining effective electromagnetic interference prevention.
Solution Approach 2:
The patent replaces the complex metal case assembly process with a simpler non-conductive encapsulation process that includes integrated EMC coating. This substitution reduces manufacturing steps, lowers production costs, and maintains effective electromagnetic shielding.
4Object-affected harmful factors
If metal cases are used for EMC shielding, then electromagnetic interference is prevented, but assembly complexity increases
Solution Approach 1:
The patent merges the EMC shielding function with the encapsulation structure into a single integrated component. This merging eliminates the need for separate metal case assembly steps and simplifies the overall assembly process, reducing device complexity while maintaining effective electromagnetic interference prevention.
Solution Approach 2:
The non-conductive encapsulation material with integrated EMC coating serves multiple functions simultaneously: mechanical protection, electromagnetic shielding, and structural support. This multi-functionality eliminates the need for separate metal case components, thereby simplifying assembly and reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The EMC coating effectively absorbs and attenuates electromagnetic interference, reducing production costs and improving yields by simplifying the assembly and reprocessing of image sensor modules.
Implementation Method 1
an electromagnetic compatibility (EMC) coating on the encapsulation to prevent electromagnetic interference
Implementation Method 2
an electromagnetic compatibility (EMC) coating on the encapsulation to prevent electromagnetic interference
Data Source
AI summary
Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.