EMC Shield Structure Combining Press-Fit and PCB Compression
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Solution Overview
Problem
Existing EMC shields face challenges in maintaining electromagnetic compatibility (EMC) and reducing gap sizes in shielding due to press-fit mounting requirements, which compromise manufacturing efficiency and increase the risk of interference, especially in high-frequency data transmission environments.
Innovation Solution
An EMC shield with integrated contact means that provide a normal force to the PCB, reducing gap sizes through direct contact pressure, either resiliently or non-resiliently, and are manufactured from a single sheet metal to enhance EMC/EMI properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If press-fit mounting is used to mount the EMC shield to the PCB, then the mounting process is simplified and cost is reduced, but gap size in the shielding increases and EMC/EMI compliance deteriorates
Solution Approach 1:
The patent combines mounting means and contact means into a single integrated structure mounted on the EMC shield. The mounting means (press-fit pins) provide mechanical attachment while the contact means (contact pins) provide electrical contact and gap reduction. This merging allows simultaneous achievement of simple press-fit mounting and reduced gap size for EMC compliance.
Solution Approach 2:
The patent segments the functional requirements by separating mounting means and contact means into distinct but integrated elements. The mounting means handle mechanical attachment while the contact means handle electrical contact and gap reduction. This segmentation allows each element to be optimized for its specific function while working together to solve the overall contradiction.
2Reliability
If multiple mounting holes are drilled in the PCB for press-fit mounting, then the EMC shield can be securely mounted, but PCB manufacturing complexity and cost increase
Solution Approach 1:
The mounting means serve multiple functions: they provide mechanical attachment of the EMC shield to the PCB, maintain positional alignment, and work in conjunction with contact means to reduce gap size. This multi-functionality reduces the need for separate mounting features and simplifies PCB manufacturing while maintaining secure mounting.
3Object-affected harmful factors
If gap size in shielding is reduced for high-frequency data transmission, then EMC/EMI compliance is improved, but mounting precision requirements increase and manufacturing difficulty increases
Solution Approach 1:
The patent changes the physical state of the contact means by making them resilient (elastic deformable). This allows the contact means to elastically deform and adapt to manufacturing tolerances, achieving tight gap sizes and good EMC compliance without requiring extremely high mounting precision. The elastic deformation compensates for dimensional variations.
Solution Approach 2:
The resilient contact means introduce dynamic adaptability to the otherwise static mounting structure. The contact means can elastically deform to accommodate variations in positioning, allowing the system to maintain small gap sizes for EMC compliance without requiring rigid precision mounting. This dynamic characteristic absorbs manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The EMC shield achieves robust, gastight contact with the PCB, reducing gaps and enhancing EMC/EMI performance while minimizing manufacturing complexity and cost, suitable for high-frequency data transmission.
Implementation Method 1
The contact means is resilient and is formed to be compressed under the contact pressure
Data Source
Figure 1~2A
Figure 2B~3
Figure 4(A)~6(B)
AI summary
The present disclosure mainly relates to electromagnetic compatibility (EMC). An EMC shield (100) for providing electromagnetic compatibility of electronic components is provided. The EMC shield comprises at least one wall (102) comprises an interface portion (104). The interface portion comprises at least one coplanar edge (106A-D) of the wall. The EMC shield further comprises at least one mounting means (108A-B) adapted for mounting the EMC shield to a printed circuit board (PCB) such that, when the EMC shield is mounted to the PCB, the interface portion is substantially parallel to the PCB. The EMC shield (100) further comprises at least one contact means (112) different from the mounting mean(s). The contact mean(s) are integrated with the wall and at least partially extending outwards the interface portion (104) in a mounting direction of the EMC shield to the PCB. The contact means are adapted for providing, when the EMC shield is mounted to the PCB, a contact pressure between the contact means and the PCB along the mounting direction.