EMC Shield With Press-Fit Contacts For Flexible Size Adaptation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electromagnetic compatibility (EMC) shields for electronic devices are inflexible in terms of size modification and may not effectively address the varying electromagnetic interference (EMI) requirements across different electronic devices, necessitating a more adaptable and efficient shielding solution.
Innovation Solution
A unitary EMC shield constructed from conductive metal with a top wall and opposing side walls, featuring press-fit contacts for mounting to a substrate, allowing for easy modification in size and production through a progressive stamping method, ensuring secure and reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional EMC shields with soldered pads or pins are used, then reliable electrical connections are achieved, but the shields are inflexible in terms of size modification and production adaptability
Solution Approach 1:
The patent changes the mounting method parameter from traditional soldered pads/pins to press-fit contacts. This allows the same basic shield design to be adapted to different sizes by simply adjusting the press-fit contact dimensions and positions, without requiring fundamental redesign of the mounting structure. The press-fit contacts can be easily modified in size and configuration to accommodate different shield dimensions.
Solution Approach 2:
The shield is divided into a body portion and separate press-fit contact elements. This segmentation allows the contacts to be independently optimized and modified without affecting the main shield structure. The contacts can be attached to the shield body through various methods (soldering, riveting, crimping), providing flexibility in both design and manufacturing while enabling easy size adjustments.
2Object-affected harmful factors
If EMC shields are designed for specific sizes, then EMI shielding effectiveness is optimized, but the shields cannot be readily adapted to different device configurations
Solution Approach 1:
The shield design incorporates adjustable and reconfigurable press-fit contacts that can be positioned at different locations and orientations. This dynamic capability allows the same shield body to be adapted to different device configurations while maintaining optimal EMI shielding performance. The contacts can be repositioned or reconfigured to match various mounting requirements without compromising the shielding effectiveness of the main shield structure.
3Reliability
If traditional soldered mounting methods are used, then secure electrical connections are achieved, but the manufacturing process is time-consuming and less efficient
Solution Approach 1:
The patent replaces the traditional soldering process (thermal/chemical system) with a press-fit mechanical connection system. The press-fit contacts can be installed through simple insertion and securing operations, which can be automated more easily than soldering. This mechanical substitution maintains reliable electrical connections while significantly improving manufacturing efficiency and reducing process complexity.
Solution Approach 2:
The press-fit contacts are pre-formed and pre-positioned on the shield body before final assembly. This preliminary preparation allows for pre-quality control and ensures proper alignment and connection reliability before the shield is installed in the device. The pre-formed contacts eliminate the need for complex soldering operations during final assembly, improving both reliability and productivity.
Data Source
AI summary
An electromagnetic compatability (EMC) shield and a method of producing the same are disclosed. The EMC shield is for mounting to a substrate having a plurality of holes formed therein, such as a printed circuit board. The EMC shield is formed from a sheet of conductive metal and includes a top wall having opposing side portions. A pair of opposing first side walls are joined to the top wall at first bends, respectively. Each first side wall has a bottom portion with a plurality of mounting contacts extending therefrom. The mounting contacts may have a press-fit construction and are adapted for receipt in the holes of the substrate. The EMC shield further includes a pair of opposing second side walls, each of which is joined by a second bend to one of the first side walls. Each second side wall has a top portion that at least partially adjoins one of the side portions of the top wall.