EMC Wafer Support Structure for Adjustable Semiconductor Package Thickness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor device fabrication methods using support plates are inadequate, requiring costly materials like silicon carbide, silicon nitride, or glass, and involve complex processes that do not efficiently adjust package thickness or reduce fabrication costs.
Innovation Solution
The use of an epoxy molding compound (EMC) wafer support system allows for connecting an interposer and semiconductor die, enabling batch processing and reducing fabrication costs by adjusting the overall package thickness through a simplified method that includes forming a seed layer, encapsulation units, and bonding solder balls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional support plates made of silicon carbide, silicon nitride, or glass are used, then structural strength and stability are improved, but fabrication cost and process complexity increase
Solution Approach 1:
The patent replaces expensive, durable support plates (silicon carbide, silicon nitride, glass) with a disposable EMC wafer support structure. The EMC wafer is designed to be used once and then discarded after serving its support function, eliminating the need for costly material recovery and cleaning processes while maintaining sufficient structural strength during the fabrication process.
Solution Approach 2:
The patent changes the material parameter from traditional rigid support plate materials (silicon carbide, silicon nitride, glass) to EMC material, which has different mechanical and thermal properties. This parameter change allows the support structure to be formed using the same molding process as the semiconductor package itself, simplifying manufacturing while providing adequate support during fabrication.
2Stability of the object's composition
If conventional support plates are used, then wafer support stability is improved, but package thickness adjustment flexibility decreases
Solution Approach 1:
The EMC wafer support structure serves multiple functions: it provides mechanical support for the semiconductor wafer during fabrication, acts as a template for the final package structure, and enables thickness adjustment by varying the EMC layer thickness. This multi-functionality eliminates the need for separate support plates and provides design flexibility for different package thickness requirements.
Solution Approach 2:
The patent introduces dynamic adjustability in package thickness by allowing the EMC wafer thickness to be varied according to different product requirements. The support structure transitions from a fixed-thickness conventional plate to a variable-thickness EMC-based structure that can be optimized for each specific application.
3Manufacturing precision
If complex support plate processes are used, then fabrication precision is improved, but manufacturing time and complexity increase
Solution Approach 1:
The patent merges the support plate function with the EMC molding process. Instead of using a separate support plate that requires additional handling, cleaning, and removal steps, the support structure is integrated into the EMC wafer itself through a single molding operation. This consolidation maintains fabrication precision while dramatically reducing process complexity.
Solution Approach 2:
The patent extracts the support plate function from the traditional fabrication process and integrates it directly into the EMC wafer structure. By taking out the separate support plate component and incorporating its functionality into the molded EMC structure, the process becomes simpler while maintaining the necessary support and precision functions.
4Strength
If traditional wafer support systems are used, then structural support is improved, but fabrication cost and time increase
Solution Approach 1:
The EMC wafer support structure is designed as a disposable component that provides sufficient structural support during fabrication but does not need to be recovered or reused. This approach eliminates the time and cost associated with cleaning, maintaining, and reusing expensive support plates, thereby improving fabrication efficiency while maintaining adequate structural support.
Solution Approach 2:
The EMC wafer support structure is self-formed through the molding process itself, requiring no separate support plate handling, positioning, or removal operations. The structure serves itself as both the package substrate and the support element during fabrication, eliminating auxiliary process steps and improving overall productivity.
Data Source
AI summary
Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (TSV) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the TSV and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the TSV of the first semiconductor die.