EmDIC Driver IC Embedded in LCD Substrate Cavity
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Solution Overview
Problem
Conventional LCD modules have a larger footprint and dead space due to the integration of driver ICs using COG and COF technologies, which increases manufacturing costs and reduces display area efficiency.
Innovation Solution
A driver cavity is integrated into the TFT array substrate of the LCD panel, with a driver IC positioned within this cavity and connected via a redistribution layer (RDL) to the TFT pixels, eliminating the need for anisotropic conductive film and reducing surface traces, thereby minimizing dead space and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If driver IC is mounted using COG or COF technology, then electrical connection between driver IC and LCD panel is achieved, but the overall footprint and dead space of the LCD module increases
Solution Approach 1:
The driver IC is embedded within a cavity formed in the TFT array substrate, nesting the driver IC inside the substrate structure rather than mounting it on the surface. This eliminates the need for separate mounting areas and reduces the overall module footprint while maintaining electrical connections through the substrate.
Solution Approach 2:
The driver IC is positioned in a third dimension by creating a cavity within the substrate thickness, transitioning from a two-dimensional surface mounting approach to a three-dimensional embedded approach. This vertical integration reduces the horizontal footprint of the display module.
2Reliability
If driver IC is mounted using COG or COF technology, then electrical connection is established, but manufacturing complexity increases due to additional components like anisotropic conductive film
Solution Approach 1:
The driver IC embedding process merges the driver IC mounting, electrical connection, and substrate integration into a single unified structure. The cavity formation and driver IC placement are integrated into the existing TFT array substrate manufacturing process, eliminating the need for separate Anisotropic Conductive Film (ACF) bonding steps required in COG/COF technologies.
Solution Approach 2:
The invention extracts and eliminates the Anisotropic Conductive Film (ACF) component from the manufacturing process. By directly embedding the driver IC in the substrate cavity and using the substrate's conductive structures for electrical connection, the complex ACF bonding step is removed, simplifying manufacturing.
3Reliability
If driver IC is mounted on the surface, then electrical connection is achieved, but display area utilization decreases due to dead edge regions
Solution Approach 1:
By nesting the driver IC within the substrate cavity, the driver IC occupies space that would otherwise be part of the display area or create dead edges. This internal placement allows the display to extend closer to the physical boundaries of the module, maximizing the usable display area.
Data Source
AI summary
Disclosed is a display module and method of manufacturing the same, where the display module comprises a LCD panel, a driver IC for driving the LCD panel, and a FPC electrically coupled to the driver IC. The LCD panel includes an array of TFT pixels on a TFT array substrate. The TFT array substrate defines a driver cavity in which the driver IC is disposed. The driver IC includes an interface side and an opposing non-interface side. The interface side includes an image signal input pad and a driving signal output pad. The driver IC is configured to receive image signals from the FPC, to process the image signals into drive signals, and to transmit the drive signals to one or more of the plurality of TFT pixels via an RDL electrical connection.