EMI Compartment Shielding Structure for Compact Electronic Packages
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Solution Overview
Problem
Conventional EMI shielding structures for miniature electronic devices are often too large and heavy, lack structural coherence, and require expensive equipment for fabrication, failing to provide reliable and cost-effective electromagnetic isolation.
Innovation Solution
An integrated EMI compartment shielding structure is fabricated using a spray plating process, comprising a substrate with electronic elements, an encapsulating member with a trench to create isolated compartments, and a conformal shield made of conductive material, ensuring structural security and functional reliability in small form factor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional metal shielding cases are used, then electromagnetic isolation is provided, but the structure becomes too large and heavy for miniature devices
Solution Approach 1:
The shielding structure is segmented into multiple compartments formed by trenches in the encapsulating member, allowing isolation of different electronic components while maintaining a compact overall structure. This segmentation provides electromagnetic isolation without requiring a single large heavy shielding case.
Solution Approach 2:
The shielding compartments are nested within the encapsulating member itself, integrating the shielding function into the package structure. The trenches and conductive material are embedded within the encapsulating member, creating a compact nested arrangement that reduces overall size and weight while maintaining shielding effectiveness.
2Object-affected harmful factors
If conventional metal shielding cases are used, then electromagnetic isolation is provided, but the structure lacks structural coherence and is prone to detachment
Solution Approach 1:
The shielding function is merged with the encapsulating member by forming trenches and filling them with conductive material within the same structure. This integration creates a unified structure where the shielding compartments are inherently part of the encapsulating member, eliminating detachment issues while maintaining electromagnetic isolation.
Solution Approach 2:
The shielding structure uses composite construction with the encapsulating member material combined with conductive material (such as metal spray or electroplated coating) to create a structurally coherent shielding system. This composite approach ensures both structural integrity and electromagnetic isolation properties.
3Object-affected harmful factors
If conventional EMI shielding structures are used, then shielding is provided, but fabrication requires expensive equipment
Solution Approach 1:
The conductive material for shielding is applied through spray or electroplating processes that can be integrated into existing manufacturing lines, allowing the structure to shield itself without requiring separate expensive EMI shielding equipment. The encapsulating member with trenches serves as its own shielding structure when filled with conductive material.
Solution Approach 2:
The fabrication process replaces complex mechanical shielding assembly with chemical deposition processes (spray or electroplating). This substitution eliminates the need for expensive precision mechanical assembly equipment while achieving effective electromagnetic shielding through conformal coating of conductive material on the trench surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides thorough electromagnetic isolation while being cost-effective and suitable for a wide range of applications, ensuring reliable EMI shielding in electronic packages from single chip devices to complex integrated structures.
Implementation Method 1
The conformal shield is disposed on the encapsulating member through a spray plating process
Data Source
AI summary
A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member. A conformal shield is disposed on the encapsulating member, electrically connecting the compartment structure through the notch.