EMI Grid Edge Adhesion Using Selective Magnetic Particles
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Solution Overview
Problem
Existing methods for attaching EMI grids to optically transparent materials result in contamination and partial delamination during encapsulation, leading to obscured fields of view and encapsulation issues.
Innovation Solution
A technique for selective magnetic adhesion of EMI grids using magnetic particles applied only at the edges, combined with a magnetic field to temporarily affix the grid, allowing for encapsulation without disturbing the optical surface and ensuring edge integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing methods are used to attach EMI grids to optically transparent materials, then the grid can be secured to the substrate, but contamination and partial delamination occur during encapsulation, leading to obscured fields of view and encapsulation issues
Solution Approach 1:
The patent applies magnetic particles selectively only to the edge portions of the EMI grid rather than the entire surface, segmenting the magnetic adhesion function to occur only where needed for securing the grid, thereby preventing contamination of the optical surface while maintaining reliable attachment
Solution Approach 2:
The patent introduces magnetic particles as an intermediary substance between the EMI grid and the substrate, which enables temporary magnetic attachment during manufacturing. This intermediary allows for reliable grid positioning without direct permanent bonding that would cause delamination during encapsulation
2Strength
If magnetic particles are applied to the entire EMI grid surface, then strong magnetic adhesion is achieved, but the optical surface becomes contaminated and the field of view is obscured
Solution Approach 1:
The patent applies magnetic particles only to the edge portions of the EMI grid rather than uniformly across the entire surface, creating local quality differentiation where magnetic adhesion strength is high at the edges but the central optical surface remains clean and transparent for optimal field of view
3Stability of the object's composition
If the grid is firmly attached to the substrate, then positioning stability is improved, but encapsulation becomes difficult and delamination occurs
Solution Approach 1:
The patent creates a dynamic attachment system where the magnetic field can be applied and removed on demand. During manufacturing, the magnetic field holds the grid firmly in position, but when the field is removed, the grid can be easily separated for encapsulation without delamination, enabling both stable positioning and ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures clear optical transmission and effective encapsulation by avoiding contamination and delamination, maintaining the integrity of the EMI grid's field of view and structural adhesion.
Implementation Method 1
applying a magnetic field to a bottom surface of the substrate, the magnetic field attracting the magnetic particles downward toward the substrate
Data Source
AI summary
A method includes positioning a grid onto a substrate that includes one or more bus bars on a top surface. The method also includes selectively applying magnetic particles to portions of a top surface of the grid. The method further includes applying a magnetic field to a bottom surface of the substrate, the magnetic field attracting the magnetic particles downward toward the substrate. In addition, the method includes applying an encapsulation layer over the grid while the magnetic field is applied to the bottom surface of the substrate.