EMI Mesh Shield for Direct TIM Coupling in SOC Cooling
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Solution Overview
Problem
The existing thermal management systems for system-on-a-chip (SOC) devices face inefficiencies in heat dissipation due to increased thermal resistance caused by multiple intervening materials and layers, which also compromise electromagnetic interference (EMI) shielding, as these materials reduce the surface area contact between the SOC die and heat spreaders.
Innovation Solution
A thermal interface EMI shield with a mesh-like conductive lid having windows that allows thermal interface material (TIM) to directly couple the SOC die and heat spreader, reducing the thickness of materials between them while providing EMI shielding through a conductive mesh structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If multiple materials and layers are used for EMI shielding between SOC die and heat dissipation components, then electromagnetic interference shielding is provided, but thermal resistance increases and heat dissipation efficiency decreases
Solution Approach 1:
The shielding lid is segmented into a mesh structure with multiple conductive elements arranged in a pattern, creating openings that allow thermal interface material to pass through. This segmentation maintains EMI shielding capability through the distributed conductive elements while reducing thermal resistance by enabling direct thermal coupling paths.
Solution Approach 2:
The shielding lid employs a mesh structure with controlled openings that function similarly to porous materials. The mesh allows thermal interface material to extend through the openings, creating direct thermal contact between the SOC die and heat dissipation components, while the conductive mesh elements maintain electromagnetic shielding effectiveness.
2Object-affected harmful factors
If multiple materials and layers are used for EMI shielding, then electromagnetic interference shielding is provided, but the surface area contact between SOC die and heat spreader is reduced
Solution Approach 1:
The shielding lid is segmented into a mesh structure with multiple conductive elements arranged in a pattern, creating openings that allow thermal interface material to pass through. This segmentation maintains EMI shielding capability through the distributed conductive elements while reducing thermal resistance by enabling direct thermal coupling paths.
Solution Approach 2:
The mesh structure introduces a three-dimensional configuration with vertical extensions through the mesh openings, allowing thermal interface material to reach from the SOC die surface through the mesh to the heat dissipation components below, effectively utilizing the vertical dimension to maintain surface area contact despite the presence of the shielding structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation by reducing thermal resistance and maintaining effective EMI shielding, allowing for improved operational capabilities of SOC devices by facilitating direct thermal coupling between the SOC die and heat spreader.
Implementation Method 1
thermal interface material (TIM) coupled to the conductive material
Implementation Method 2
shielding lid thermally coupled to the semiconductor die along the surface of the semiconductor die
Data Source
AI summary
The present disclosure is directed to thermal management and electromagnetic interference (EMI) shielding techniques for a system on a chip (SOC) device to reduce the thermal resistance between a SOC die of the SOC device and heat dissipation components, while still providing EMI shielding to components of the SOC device. For example, a SOC device may include an EMI mesh disposed on the SOC die. The EMI mesh includes a plurality of windows such that a thermal interface material (TIM) may extend through the plurality of windows and physically couple both the heat dissipation components (e.g., a spreader) and the SOC die while still providing EMI shielding to the SOC die.