EMI Shielding Package Structure With Conductive Dam Wire Support
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Solution Overview
Problem
Existing package structures face issues with wire bond tilt or misalignment, leading to short circuits and open circuits, which compromise the reliability and electromagnetic shielding performance, particularly in high-frequency RF modules.
Innovation Solution
A package structure with a conductive dam surrounding the chip, combined with wires and a conductive layer forming a Faraday cage, reduces wire height and enhances stability, preventing misalignment and improving shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are used to form the side of the Faraday cage, then the electromagnetic shielding functionality is achieved, but the wires are prone to tilt or misalignment causing short circuits and open circuits
Solution Approach 1:
The side walls of the Faraday cage are segmented into multiple wire sections rather than using single continuous wires. These segmented wire sections are positioned on separate insulating structures, which divides the shielding function into multiple stable segments, reducing the risk of complete failure from wire tilt or misalignment.
Solution Approach 2:
Insulating structures are introduced as intermediary elements between the wires and the substrate. These insulating structures provide stable positioning and electrical isolation, mediating the connection between the conductive wires and the grounding system while preventing direct contact that could cause short circuits.
2Reliability
If wire height is reduced to improve stability, then wire tilt and misalignment are prevented, but the electromagnetic shielding effectiveness may be compromised
Solution Approach 1:
The solution moves from adjusting wire height in the vertical dimension to using insulating structures that extend in horizontal dimensions. The insulating structures provide lateral support and positioning, allowing wires to maintain proper height and alignment through horizontal constraints rather than vertical adjustment.
Solution Approach 2:
The Faraday cage structure becomes a composite system combining conductive wires for electromagnetic shielding with insulating structures for mechanical support and positioning. This composite approach allows the wires to be shorter and more stable while the insulating materials provide the necessary structural framework to maintain shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure stabilizes wires, preventing short and open circuits, thereby enhancing reliability and electromagnetic shielding effectiveness.
Implementation Method 1
the conductive layer, the wires, and the conductive dam together form a Faraday cage surrounding the chip
Data Source
AI summary
A package structure with electromagnetic shielding functionality includes: a substrate; a chip, disposed on a surface of the substrate; a conductive dam, disposed on the surface of the substrate and grounded, the conductive dam surrounding a periphery of the chip; a plurality of wires, disposed on the conductive dam; a molding body, covering the surface of the substrate and encapsulating the chip, the conductive dam, and the wires, wherein a portion of each of the wires is exposed on a surface of the molding body; and a conductive layer, positioned outside the molding body and at least corresponding to the chip, wherein the conductive layer is electrically connected to the wires, and the conductive layer, the wires, and the conductive dam together form a Faraday cage surrounding the chip.