EMI-Absorbing Polymer Sensor Connector Without Added Shielding

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Solution Overview

Problem

Conventional pressure sensors are vulnerable to electromagnetic interference (EMI) due to their connectors being electromagnetically open, leading to degraded functionality and potential interference with other system components, with existing shielding solutions often increasing costs and complexity.

Innovation Solution

Incorporating an EMI absorbing material into the polymer connector of pressure sensors, either by entraining it within the polymer or applying a coating, to absorb electromagnetic interference without altering the sensor's size, shape, or manufacturing process, thereby reducing the need for additional components and maintaining original functionality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conventional polymer connectors are used, then manufacturing cost and complexity are reduced, but electromagnetic interference protection is insufficient

Engineering Contradiction:
ImproveEMI protectionVSAvoidconnector structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent applies composite materials by combining polymer matrix with conductive particles (carbon black, metal powders, or conductive polymers) to create a connector that simultaneously provides electrical connectivity and EMI shielding. This composite approach integrates multiple functions into a single material system, achieving EMI protection without increasing device complexity or requiring additional shielding components.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the electrical parameters of the polymer connector by incorporating conductive fillers that alter its conductivity, dielectric properties, and electromagnetic interaction characteristics. By adjusting the concentration and type of conductive particles, the connector's EMI shielding effectiveness can be tuned while maintaining its mechanical and electrical connection functions.

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If additional shielding components are added, then EMI absorption is improved, but manufacturing cost and device complexity increase

Engineering Contradiction:
ImproveEMI absorptionVSAvoidmanufacturing process
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent merges the EMI shielding function with the connector body by incorporating conductive particles directly into the polymer matrix during the molding process. This integration eliminates the need for separate shielding components, simplifies assembly, and reduces manufacturing steps while achieving effective EMI absorption throughout the connector structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent modifies the material composition parameters of the polymer connector by adding conductive fillers at specific concentrations (typically 10-40% by weight). This parameter change transforms the electrical properties of the polymer, enabling intrinsic EMI shielding capability without requiring additional manufacturing processes or components.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly enhances EMI absorption, maintains the original sensor configuration, increases placement flexibility, and reduces overall costs while effectively dampening external electrical fields and resonant frequencies.

Implementation Method 1

Incorporating an EMI absorbing material into the polymer connector of pressure sensors, either by entraining it within the polymer or applying a coating, to absorb electromagnetic interference without altering the sensor's size, shape, or manufacturing process

Methodology Applied
Scientific EffectElectromagnetic absorption: Absorption (EM radiation)

Data Source

PatentUS11898920B2Electromagnetic interference absorbing sensor connector
Publication Date: 2024.02.13 SENSATA TECHNOLOGIES INC
  • US11898920B2 patent drawing
  • US11898920B2 patent drawing
  • US11898920B2 patent drawing

AI summary

A connector for use with a sensor, such as a pressure sensor, has EMI absorbing capabilities. The connector includes a polymeric body configured for coupling to a sensor body and an EMI absorbing material. The EMI absorbing material may be entrained in the polymeric body, coated on the polymeric body, or otherwise integrated with the polymeric body. The EMI absorbing material may be carbon black or carbon nanotubes.