EMI-Enclosed Power Connector With Flap-Based Heat Dissipation
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Solution Overview
Problem
Power connectors face challenges in thermal management, particularly in small enclosures, where heat transfer is hindered by rigid surfaces and air gaps with low thermal conductivity, making it difficult to maintain components at different temperatures effectively.
Innovation Solution
A power connector design featuring an EMI enclosure with flaps thermally coupled to heat-generating components, providing both electromagnetic shielding and efficient heat dissipation through thermally conductive materials and strategically placed thermal interfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If rigid enclosure surfaces are used to provide EMI shielding, then electromagnetic protection is improved, but thermal transfer capability deteriorates due to air gaps with low thermal conductivity
Solution Approach 1:
The patent applies this principle by replacing rigid enclosure surfaces with flexible thermal transfer surfaces that can conform to component shapes. The flexible material eliminates air gaps while maintaining thermal conductivity, allowing heat to transfer effectively from components to the EMI-shielded enclosure structure.
Solution Approach 2:
The patent introduces a thermal transfer surface as an intermediary between heat-generating components and the rigid EMI-shielding enclosure. This mediator material bridges the thermal gap while the enclosure itself maintains electromagnetic protection, resolving the contradiction between thermal and EMI requirements.
2Volume of stationary object
If components are arranged in a small package to fit within the enclosure, then device compactness is improved, but thermal management difficulty increases
Solution Approach 1:
The flexible thermal transfer surface can be customized to fit tightly around components in compact arrangements, maximizing thermal contact area within limited space. This allows effective heat dissipation even when components are densely packed in a small enclosure volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from components while maintaining electromagnetic shielding, ensuring efficient thermal management and temperature control within the power connector.
Implementation Method 1
The first flap includes a flap thermal interface thermally coupled to the electrical component to dissipate heat from the electrical component
Implementation Method 2
The walls of the EMI enclosure provide EMI shielding for the electrical component
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
A power connector (100) includes a housing (110) having a front wall including a socket configured to receive a power plug. Power contacts are held by the housing (110), the power contacts having mating ends in the socket for mating with the power plug. The power connector (100) includes an electrical component (104) held by the housing (110) being electrically connected to at least one of the power contacts. The electrical component (104) is a heat generating component. The power connector includes an EMI enclosure (200) coupled to the housing (110). The EMI enclosure (200) has walls defining a chamber. The housing (110), power contacts, and electrical component (104) are received in the chamber. The walls of the EMI enclosure (200) provide EMI shielding for the electrical component (104). The EMI enclosure (200) includes a flap (236) extending from a wall of the EMI enclosure (200) into the chamber. The flap (236) is deflectable relative to the wall. The flap (236) has a flap thermal interface (250a) thermally coupled to the electrical component (104) to dissipate heat from the electrical component (104).