EMI-Preventing Socket Manufacturing via Riveted Ground Pin

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional methods for manufacturing EMI-preventing sockets are inefficient due to the lengthy soldering process, which affects manufacturing stability and is not suitable for mass production, leading to increased manpower costs and time.

Innovation Solution

A manufacturing method that connects an EMI-preventing element to the ground pin using riveting or clipping before injection molding, eliminating the need for soldering and ensuring a secure connection within the socket body.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If soldering is used to connect the EMI-preventing element to the ground pin, then the connection is secure, but the manufacturing time and complexity increase

Engineering Contradiction:

Improveconnection strengthVSAvoidmanufacturing time

Core Design Contradiction:

StrengthVSLoss of time

Solution Approach 1:

The EMI-preventing element is pre-connected to the ground pin before the injection molding process. This preliminary connection eliminates the need for post-molding soldering operations, reducing manufacturing time while maintaining connection strength through the molding material that encapsulates the joint.

Inventive Principle:

Principle #10Preliminary action

2Strength

If soldering is used to connect the EMI-preventing element to the ground pin, then the connection is secure, but the manufacturing process stability decreases

Engineering Contradiction:

Improveconnection strengthVSAvoidmanufacturing process stability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The soldering process (thermal/chemical joining) is replaced with a mechanical connection method where the EMI-preventing element is physically connected to the ground pin and then encapsulated by injection molded material. This substitution eliminates the variability and stability issues associated with soldering processes while maintaining secure connections.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If soldering is used to connect the EMI-preventing element to the ground pin, then the connection is secure, but the device complexity increases

Engineering Contradiction:

Improveconnection strengthVSAvoidmanufacturing process complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The connection operation and the molding operation are merged into a single integrated process. The EMI-preventing element is connected to the ground pin, and then the injection molding process encapsulates both components and their joint in one step, eliminating the need for separate soldering operations and reducing overall manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS8997345B2EMI-preventing socket and manufacturing method thereof

Publication Date: 2015.04.07 DELTA ELECTRONICS (SHANGHAI) CO LTD

AI summary

A manufacturing method for an EMI-preventing socket comprises the following steps of providing an EMI-preventing element and a plurality of pins, wherein at least one of the pins is a ground pin; connecting the EMI-preventing element to the ground pin via a direct physical connection; providing a mold; placing the EMI-preventing element, the ground pin and the remaining pins of the plurality of pins in the mold, wherein the EMI-preventing element surrounds the pins in the mold; and providing a molding material into the mold to cover the plurality of pins and to cover a joint of the EMI-preventing element and the ground pin to form a socket body of the EMI-preventing socket. Parts of the EMI-preventing element and one end of each of the plurality of pins is exposed out of the socket body of the EMI-preventing socket.