Electromagnetic Screening Structure for Moulded Interconnect Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a need for easily manufacturable electromagnetic screening structures for moulded interconnect devices (MIDs) that can effectively shield against interference radiation, particularly in optoelectronic components, where existing methods are inefficient or not suitable for non-conductive substrate materials.
Innovation Solution
A method involving the inclusion of non-conductive metal compounds in a substrate material, where electromagnetic radiation is used to create a flat metal seed layer, followed by chemo-reductive metallisation to form a screening structure, allowing for the creation of flat, two-dimensional metal layers that can be applied to both inner and outer walls of the substrate, enhancing electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal coating is applied to the outside of the housing for electromagnetic screening, then electromagnetic shielding effectiveness is improved, but manufacturing complexity and cost increase
Solution Approach 1:
Non-conductive metal compounds are pre-distributed throughout the substrate material during manufacturing. This preliminary incorporation of metal compounds eliminates the need for subsequent metal coating applications, simplifying the manufacturing process while maintaining electromagnetic shielding effectiveness.
Solution Approach 2:
The substrate material serves multiple functions simultaneously: it provides mechanical support, electrical insulation, and electromagnetic shielding through the embedded metal compounds. This multi-functionality eliminates the need for separate shielding layers or coatings.
2Object-affected harmful factors
If conventional metal coating methods are used for screening structures, then electromagnetic shielding is achieved, but ease of manufacture deteriorates due to incompatibility with non-conductive substrates
Solution Approach 1:
The invention changes the physical and chemical parameters of the substrate material by incorporating non-conductive metal compounds during the substrate manufacturing process. This allows the non-conductive substrate to acquire electromagnetic shielding properties without requiring post-manufacturing metal coating operations.
Solution Approach 2:
The substrate material is created as a composite material combining non-conductive base material with dispersed metal compounds. This composite structure provides both electrical insulation and electromagnetic shielding properties, making it compatible with non-conductive substrate requirements while achieving shielding effectiveness.
3Ease of manufacture
If metal compounds are micro-distributed in substrate material for conductor path structures, then conductor paths can be formed, but electromagnetic shielding capability is insufficient without additional metal coating
Solution Approach 1:
The invention applies local quality by concentrating metal compounds in specific regions of the substrate where shielding is required, rather than uniformly distributing them throughout. This allows conductor paths to be formed in metal-free regions while achieving electromagnetic shielding in metal-compound-rich regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the efficient manufacture of electromagnetic screening structures on non-conductive substrates, effectively reducing interference radiation and emission, while integrating mechanical and electrical functions within the substrate, thus improving the reliability and performance of optoelectronic components.
Implementation Method 1
Through exposure to laser radiation the metal compounds are broken open in the region of the conductor path structures to be manufactured
Implementation Method 2
Through exposure to laser radiation the metal compounds are broken open
Implementation Method 3
a metallisation, which forms the conductor path structures to be manufactured, is applied to the metal seeds that are created in the process
Data Source
AI summary
The invention relates to an electromagnetic screening structure on or in a non-conductive carrier material in which non-conductive metal compounds are placed. The screening structure comprises a flat metal seed layer formed on or in the carrier material, which is formed through metal seeds that have been released through electromagnetic radiation, and a flat metal coating which is applied over the metal seed layer and which is in contact with said metal seed layer. The invention additionally relates to an electronic or optoelectronic used with the screening structure and a method for manufacturing the screening structure. In a further aspect of the invention, an electronic or optoelectronic assembly is provided with a carrier element, wherein at least one additional electrical or optoelectronic component is arranged on the surface of the carrier material and is in contact with conductor path structures formed on the carrier surface.