EMI Noise Shield Board with Embedded EBG Structure
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Solution Overview
Problem
Existing electronic boards face challenges in shielding electromagnetic interference (EMI) noise, particularly radiation noise, from surfaces without electronic components, as conventional shielding methods like metal caps or EMI absorbents cannot be installed on these areas.
Innovation Solution
Incorporating an electromagnetic bandgap (EBG) structure within the board on the surface without electronic components, utilizing conductive plates and stitching vias to create a band stop frequency property that shields EMI noise from being radiated outside.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional shielding methods (metal caps or EMI absorbents) are installed on surfaces with electronic parts, then radiation noise is shielded, but shielding cannot be applied to surfaces without electronic parts
Solution Approach 1:
The patent transitions from surface-mounted shielding (2D plane) to embedded volumetric shielding (3D space) by inserting EBG structures within the board substrate. This allows shielding coverage on surfaces without electronic components by utilizing the internal volume of the board rather than requiring surface mounting.
Solution Approach 2:
The EBG structure is nested within the board substrate, with conductive plates and stitching vias embedded inside the dielectric material. This nested configuration enables the shielding function to be integrated into the board's internal structure, making it applicable to entire board surfaces including areas without electronic parts.
2Object-affected harmful factors
If EBG structure is inserted in the second board portion, then EMI noise radiation is reduced, but board structure complexity increases
Solution Approach 1:
The EBG structure is segmented into discrete conductive plates arranged in periodic patterns within the dielectric substrate. This segmentation creates the bandgap effect while maintaining manufacturability through standardized plate geometries and spacing, balancing shielding performance with structural complexity.
Solution Approach 2:
The patent optimizes parameters such as conductive plate dimensions, spacing, and stitching via configurations to achieve effective EMI shielding. By carefully selecting these parameters, the structure achieves noise reduction while controlling manufacturing complexity and maintaining compatibility with standard PCB fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces EMI noise radiation by up to 10 dB across the 100 to 800 MHz band, enhancing the shielding performance of electronic boards without the need for additional shielding components on non-electronic surfaces.
Implementation Method 1
an electromagnetic bandgap structure having a band stop frequency property in such a way that an EMI noise transferred from the first board portion may be shielded from being radiated to the outside of a board
Data Source
AI summary
An EMI noise shield board, in which an EBG structure is inserted, includes a first board portion and a second board portion. The first board portion has an upper surface, on which an electronic part is disposed, and a circuit for transferring a signal and power to the electronic part. The second board portion is located on a lower surface of the first board portion. The electromagnetic bandgap structure is inserted into the second board portion, and has a band stop frequency property such that an EMI noise transferred from the first board portion is shielded from being radiated to the outside of the EMI noise shield board.