Integrated EMI Shield Layer in Camera Module Molding

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Solution Overview

Problem

Existing camera module designs face challenges in reducing size and protecting against adverse environmental factors, particularly due to the use of separate EMI lids that increase module size and complexity.

Innovation Solution

A camera module design that incorporates a routing substrate with a ground plane, an image sensor, electrical components, a molding compound, and an EMI shield layer tied to the ground plane, which can include multiple metal layers for adhesion, shielding, and protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a separate EMI lid is used to shield the camera module, then electro-magnetic interference protection is improved, but the camera module size increases and structural complexity increases

Engineering Contradiction:

ImproveEMI protectionVSAvoidcamera module size

Core Design Contradiction:

Object-affected harmful factorsVSVolume of stationary object

Solution Approach 1:

The EMI shield layer is integrated directly into the molding compound that encapsulates the image sensor and electrical components, eliminating the need for a separate EMI lid. The shield layer becomes part of the existing structural component rather than an additional separate part, thus maintaining EMI protection while reducing overall module size and simplifying structure.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The molding compound serves multiple functions: it provides mechanical support for the image sensor and electrical components, and simultaneously incorporates the EMI shield layer to provide electro-magnetic interference protection. This multi-functional integration eliminates the need for dedicated separate components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Object-affected harmful factors

If a separate EMI lid is used to shield the camera module, then electro-magnetic interference protection is improved, but device complexity increases

Engineering Contradiction:

ImproveEMI protectionVSAvoidstructural complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

3Object-affected harmful factors

If the EMI shield layer is tied to the ground plane, then EMI shielding effectiveness is improved, but manufacturing complexity increases

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoidmanufacturing complexity

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The ground plane is designed with exposed ends or extensions that are positioned to make contact with the EMI shield layer during the molding process. This preliminary positioning ensures that the electrical connection is established automatically as part of the standard molding operation, without requiring additional post-assembly steps to tie the shield to ground.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The molding process itself serves to both encapsulate the components and establish the electrical connection between the EMI shield layer and the ground plane. The structure is designed so that the act of molding automatically creates the grounding connection, making the system self-servicing rather than requiring separate manual intervention.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the camera module's size, eliminates the need for a separate EMI lid, and enhances thermal dissipation, leading to improved image quality and reduced manufacturing costs.

Implementation Method 1

an electro-magnetic interference, EMI, shield layer disposed on the molding compound, wherein the EMI shield layer is tied to the ground plane of the routing substrate

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

a routing substrate having a ground plane coupled between a first side of the routing substrate and a second side of the routing substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4557753A1Electro-magnetic interference shielding for camera module

Publication Date: 2025.05.21 META PLATFORMS TECHNOLOGIES LLC

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AI summary

A camera module includes a routing substrate, an image sensor, electrical components, molding compound, and an electro-magnetic interference (EMI) shield layer. The routing substrate has a ground plane coupled between a first side of the routing substrate and a second side of the routing substrate. The image sensor is configured to receive incident image light. The electrical components are electrically coupled to the second side of the routing substrate. The molding compound supports the image sensor and supports the electrical components. The EMI shield layer is disposed on the molding compound and the EMI shield layer is tied to the ground plane of the routing substrate.