EMI Shield Can With Integrated Phase Change Material
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Solution Overview
Problem
Mobile computing devices face challenges in thermal management due to limited space, where conventional thermal control techniques are less effective in heat dissipation and distribution, and existing phase change materials are inadequate for temporary heat retention.
Innovation Solution
Integrating thermally active phase change material within an electro-magnetic interference (EMI) shield can surrounding a printed circuit board, which absorbs and retains heat produced by processing components, maintaining isothermal conditions and delaying performance throttling through the use of PCM or mixed PCM sheet metals/metal alloys.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal control techniques like heat sinks and fans are used, then heat dissipation is improved, but device size increases and profile thickness increases
Solution Approach 1:
The patent combines the EMI shield can with phase change material (PCM) to create a multi-functional component that provides both electromagnetic shielding and thermal management, eliminating the need for separate heat sinks or thermal control components
Solution Approach 2:
The patent utilizes phase change material that changes physical state (solid-liquid transition) at specific temperature thresholds to absorb and release heat, dynamically adjusting thermal parameters without increasing device volume
2Temperature
If vapor chambers with liquid vapor phase change material are used, then heat distribution is improved, but temporary heat retention capability is reduced
Solution Approach 1:
The patent employs phase change material that undergoes solid-liquid phase transition to simultaneously achieve heat distribution through latent heat absorption and heat retention by maintaining the phase change process over time, addressing both heat management needs
Solution Approach 2:
The patent uses composite material combining EMI shield can with integrated PCM, creating a structure that provides both electromagnetic shielding and dual functionality of heat distribution and retention through the phase change properties
3Temperature
If more space is allocated for thermal management components, then thermal performance is improved, but processing capability and memory capacity are reduced
Solution Approach 1:
The EMI shield can is designed to serve multiple functions: electromagnetic interference shielding, heat dissipation, and heat retention through integrated phase change material, eliminating the need for dedicated thermal management space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively extends the duration of high-performance usage in mobile devices by maintaining isothermal conditions and delaying performance throttling, while maintaining slim profiles, by utilizing phase change materials that absorb and retain heat within the shield can.
Implementation Method 1
When the heat exceeds the melting point of the phase change material, the phase change material melts to absorb additional heat
Implementation Method 2
the features will typically have significantly higher latent heat capacitance than the composite materials of the shield itself
Implementation Method 3
The phase change material solidifies when operation of the processing components is discontinued and the temperature in the system cools
Data Source
AI summary
The invention is directed to a novel solution for improving heat management in computing devices by using thermally active material integrated within a shield can disposed over an integrated circuit or printed circuit board. By integrating the thermally active material within the shield can, isothermal conditions can be maintained for a longer period of time, thereby extending the transient state of a heat-producing system for longer durations, while maintaining slim vertical profiles.