Insertable EMI Shield Clip for Optical Transceiver Modules

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Solution Overview

Problem

Optical transceiver modules, especially those operating at high transmission speeds, are susceptible to electromagnetic interference (EMI) due to their physical configuration, which poorly contains EMI emissions, particularly at joints between the external enclosure and exposed portions of the transceiver shell, leading to interference with other electrical components.

Innovation Solution

An insertable shield clip made of conductive material with spring fingers and shield members is designed to compressively engage between the shell and enclosure, intercepting EMI emissions by positioning shield members proximate the nosepieces of optical subassemblies and establishing a common ground connection to absorb or prevent EMI from escaping.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If the transceiver module operates at high transmission speeds, then data transmission performance is improved, but electromagnetic interference emissions increase

Engineering Contradiction:
Improvedata transmission speedVSAvoidEMI emissions
Core Design Contradiction:
SpeedVSObject-generated harmful factors

Solution Approach 1:

An EMI shield clip made of conductive material is introduced as an intermediary component between the shell and enclosure. The shield clip includes shield members positioned between EMI-generating components (optical subassemblies) and the external environment, effectively blocking electromagnetic interference from escaping while allowing high-speed data transmission to continue

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If the shell and enclosure are directly engaged, then structural simplicity is maintained, but EMI containment is poor at joint areas

Engineering Contradiction:
Improvestructural complexityVSAvoidEMI emissions from joints
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

The EMI shielding solution is segmented into multiple components: the shield clip body, multiple shield members (first and second shield members), and spring fingers. This segmentation allows the shield to be inserted into the existing shell-enclosure joint without requiring complete redesign of the housing structure, maintaining relative simplicity while effectively blocking EMI at critical joint areas

Inventive Principle:
Principle #1Segmentation

3Object-generated harmful factors

If shield members are positioned proximate to optical subassembly nosepieces, then EMI interception is improved, but device complexity increases

Engineering Contradiction:
ImproveEMI interception effectivenessVSAvoidshield structure complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

Multiple functional elements are merged into a single integrated shield clip component: the conductive shield members, the spring fingers for compressive engagement, and the structural body are combined into one piece that can be inserted as a single unit. This merging reduces assembly complexity while maintaining effective EMI interception at the optical subassembly nosepieces

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The shield clip effectively reduces EMI emissions from specified areas of the optical transceiver module, maintaining safe EMI levels as per industry guidelines, even at high frequency operations, thereby enhancing the module's EMI containment performance.

Implementation Method 1

An insertable shield clip made of conductive material with spring fingers and shield members is designed to compressively engage between the shell and enclosure, intercepting EMI emissions by positioning shield members proximate the nosepieces of optical subassemblies and establishing a common ground connection to absorb or prevent EMI from escaping

Methodology Applied
Scientific EffectElectromagnetic interference shielding: Faraday Cage

Data Source

PatentUS7978974B2Insertable EMI shield clip for use in optical transceiver modules
Publication Date: 2011.07.12 II VI DELAWARE INC
  • US7978974B2 patent drawing
  • US7978974B2 patent drawing
  • US7978974B2 patent drawing

AI summary

The embodiments disclosed herein relate an insertable shield clip for use in controlling electromagnetic interference in an optical transceiver module. The optical transceiver module may include a shell that houses first and second optical subassemblies and an enclosure that cooperates with the shell in defining a covering for the optical transceiver module. The shield clip may comprise a body composed of conductive material. The body may include first and second vertical side members. The body may also include first and second shield members that are each configured to receive a corresponding nosepiece of one of the first and second optical subassemblies. The body may further include a bottom member that interconnects the first and second vertical side members and the first and second shield members.