Semiconductor Package EMI Shielding via Conductive Spacer
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Solution Overview
Problem
The increasing demand for small and lightweight electronic components in mobile devices necessitates semiconductor packages that integrate high-frequency signals while providing effective resistance against electromagnetic interference (EMI) to prevent electromagnetic wave noise and ensure reliable device operation.
Innovation Solution
A semiconductor package design featuring a conductive spacer and EMI shield structure, where the conductive spacer is electrically connected to the EMI shield and ground pad, providing a ground path to shield electromagnetic interference, and the package substrate is a double-sided printed circuit board with a molding unit covering the components and exposing a portion of the conductive spacer for electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple EMI shields are added to provide excellent resistance against electromagnetic interference, then the shielding effectiveness is improved, but the device complexity and weight increase
Solution Approach 1:
The patent combines multiple EMI shield functions into a single integrated EMI shield structure that simultaneously shields the package substrate, first semiconductor chip, and second semiconductor chip. This unified approach provides comprehensive EMI protection while avoiding the complexity and weight of multiple separate shield structures.
Solution Approach 2:
The EMI shield is designed to perform multiple shielding functions simultaneously - protecting the package substrate, first semiconductor chip, and second semiconductor chip from electromagnetic interference. This multi-functional design achieves excellent EMI resistance without requiring separate shields for each component.
2Reliability
If multiple EMI shields are added to provide excellent resistance against electromagnetic interference, then the shielding effectiveness is improved, but the weight increases
Solution Approach 1:
The patent merges multiple EMI shield functions into a single lightweight structure that protects all semiconductor chips and the package substrate simultaneously. This approach provides excellent EMI resistance while minimizing weight compared to using multiple separate shields.
Solution Approach 2:
The EMI shield performs multiple shielding functions in one structure, protecting the package substrate, first semiconductor chip, and second semiconductor chip from electromagnetic interference. This multi-functional design achieves comprehensive EMI protection without the weight penalty of multiple separate shields.
3Volume of moving object
If the semiconductor package is reduced in size for mobile devices, then the compactness is improved, but the EMI shielding effectiveness may deteriorate
Solution Approach 1:
The patent transitions from horizontal placement to vertical stacking of semiconductor chips, allowing multiple chips to be mounted in a compact volume while maintaining effective EMI shielding. The EMI shield covers the vertical arrangement, providing comprehensive protection within a reduced package footprint.
Solution Approach 2:
The EMI shield is designed to simultaneously protect the package substrate and vertically stacked semiconductor chips within a compact package volume. This integrated approach maintains excellent EMI resistance while achieving the small size required for mobile devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces electromagnetic interference, enhancing the reliability and performance of electronic devices by grounding the EMI shield and ensuring efficient signal transmission without compromising the compactness and weight of the semiconductor package.
Implementation Method 1
The second portion of the conductive spacer may be electrically connected to the EMI shield. A lower surface of the conductive spacer may be electrically connected to the ground pad.
Implementation Method 2
an electromagnetic interference (EMI) shield that covers the molding unit
Data Source
AI summary
A semiconductor package includes a package substrate including a ground pad; a a conductive spacer and a first semiconductor chip disposed on the package substrate; a second semiconductor chip on the conductive spacer and the first semiconductor chip; a molding unit that covers the package substrate, the first semiconductor chip, the second semiconductor chip, and a first portion of the conductive spacer, and exposes a second portion of the conductive spacer; and an electromagnetic interference (EMI) shield that covers the molding unit.