Stamped EMI Shield Dome for Thermal Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing EMI shielding and heat spreading solutions for electronic devices often require multiple parts and complex assembly processes, making them costly and time-consuming, especially for small form factor devices that lack integrated heat spreader functionality.
Innovation Solution
A stamped sheet metal EMI shield with a dome feature that can be flipped or depressed to make thermal contact with logic components, allowing for simultaneous EMI shielding and heat spreading without additional assembly steps, and can be soldered to the motherboard alongside other logic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate EMI shielding and heat spreading components are used, then EMI protection and thermal management functions are provided, but assembly complexity and cost increase
Solution Approach 1:
The patent combines EMI shielding and heat spreading functions into a single integrated component. The EMI shield is formed with a dome feature that makes thermal contact with the logic component, eliminating the need for separate heat spreading components and reducing assembly steps while maintaining both EMI protection and thermal management functions
Solution Approach 2:
The EMI shield is designed to perform multiple functions: providing electromagnetic interference shielding and simultaneously serving as a heat spread through its dome feature. This multi-functional design allows one component to replace what would traditionally require multiple separate parts, simplifying the overall device structure
2Reliability
If multiple parts are used for EMI shielding and heat spreading, then functional requirements are met, but assembly time and cost increase
Solution Approach 1:
The EMI shield and heat spreader are merged into a single component. The dome feature is formed as an integral part of the EMI shield during the stamping process, allowing both EMI shielding and thermal contact functions to be achieved with one part, thereby reducing assembly time and eliminating the need for separate assembly steps for heat spreading components
3Object-affected harmful factors
If traditional EMI shielding without dome feature is used, then EMI protection is provided, but thermal contact with logic components is insufficient
Solution Approach 1:
The dome feature introduces a curved, three-dimensional surface to the EMI shield that makes contact with the logic component. This curved geometry ensures proper thermal contact between the shield and the heat-generating component, enabling effective heat dissipation while the metallic material continues to provide EMI shielding protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces assembly complexity and cost by integrating thermal and physical contact within a single component, enhancing the efficiency of signal transmission and thermal management in electronic devices while maintaining a low-cost and fast assembly process.
Implementation Method 1
a metallic shield to at least partially surround at least one logic component
Implementation Method 2
wherein the metallic shield is to comprise a dome feature to provide thermal contact between the at least one logic component and the metallic shield
Data Source
AI summary
Methods and apparatus relating to EMI (Electromagnetic Interference) shielding structure to enable heat spreading and/or low cost assembly are described. In an embodiment, a metallic shield at least partially surrounds at least one logic component. The metallic shield includes a dome feature to provide thermal contact between the at least one logic component and the metallic shield. Other embodiments are also disclosed and claimed.