Semiconductor Package EMI Shield Grounding via Mold Integration
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Solution Overview
Problem
Semiconductor devices face challenges with electromagnetic interference (EMI) due to increased clock speeds and smaller sizes, leading to higher electromagnetic emissions, which can affect neighboring devices. Conventional EMI shielding methods using adhesive casings are prone to peeling, require precise matching of sizes and shapes, and increase manufacturing costs and time.
Innovation Solution
A semiconductor device package design featuring a substrate unit with grounding elements and an EMI shield that is electrically connected, eliminating the need for adhesives and allowing for flexible application across different sizes and shapes, with a conformal EMI shield that reduces EMI by grounding electromagnetic emissions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electrically conductive casing is used for EMI shielding, then EMI reduction is achieved, but the casing is prone to peeling or falling off due to adhesive degradation under environmental conditions
Solution Approach 1:
The patent removes the adhesive layer from the system by integrating the EMI shield directly into the mold cavity during package manufacturing. The shield becomes an integral part of the package structure rather than a separate component requiring adhesive bonding, thereby eliminating the reliability issues associated with adhesive degradation under temperature and humidity conditions.
Solution Approach 2:
The EMI shield is merged with the package body by forming it as an integral part of the mold cavity. This combining of the shield with the packaging structure eliminates the need for separate attachment processes and adhesive materials, creating a unified structure that maintains its EMI shielding function while improving reliability.
2Object-affected harmful factors
If a custom-fitted electrically conductive casing is used for EMI shielding, then EMI protection is improved, but manufacturing cost and time increase due to precise size and shape matching requirements
Solution Approach 1:
The mold cavity serves multiple functions: it forms the package body and simultaneously creates the EMI shield structure. This universal approach allows the same manufacturing process to produce both the packaging and the shielding function, eliminating the need for custom-fitted casings and reducing manufacturing complexity across different package types.
Solution Approach 2:
The EMI shield structure is prepared in advance as part of the mold cavity design before the actual packaging process. By pre-integrating the shield geometry into the molding tooling, the patent eliminates the need for post-assembly fitting and adjustment, thereby reducing manufacturing time and cost while maintaining effective EMI protection.
3Object-affected harmful factors
If different casings are used for semiconductor device packages of different sizes and shapes, then EMI shielding effectiveness is maintained, but manufacturing complexity and cost increase
Solution Approach 1:
The patent applies local quality by creating EMI shield structures that are specifically tailored to each package's geometry through the mold cavity design. Each mold cavity is configured to produce the appropriate shield shape and size for its intended package, maintaining EMI shielding effectiveness while using a standardized manufacturing approach rather than requiring separate casing assemblies for each package type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI by providing a reliable and efficient electrical pathway for grounding emissions, enhancing manufacturing efficiency and reducing costs by allowing for standardized EMI shielding across various package configurations without the need for precise size and shape matching.
Implementation Method 1
When electromagnetic emissions from an interior of the package strike an inner surface of the casing, at least a portion of these emissions can be electrically shorted
Implementation Method 2
the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield
Data Source
AI summary
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element disposed adjacent to a periphery of the substrate unit; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of a grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.