EMI Shield Grounding for Semiconductor Packages
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Solution Overview
Problem
Semiconductor device packages face challenges with electromagnetic interference (EMI) due to high clock speeds and smaller sizes, leading to increased electromagnetic emissions, which can affect neighboring devices. Conventional shielding methods using electrically conductive casings are prone to peeling and require precise matching of sizes and shapes, increasing manufacturing costs and time.
Innovation Solution
A semiconductor device package design featuring a substrate unit with cut-out portions for grounding elements and a conformal electromagnetic interference (EMI) shield that is electrically connected to the grounding elements, providing an efficient pathway to ground electromagnetic emissions without the need for adhesives and allowing for compatibility with different package sizes and shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electrically conductive casing is used for EMI shielding, then EMI reduction is achieved, but the casing is prone to peeling or falling off due to adhesive degradation from temperature and humidity
Solution Approach 1:
The patent removes the adhesive layer from the system by integrating the EMI shield directly into the mold cavity during package molding. The shield becomes an integral part of the package structure rather than a separate component requiring adhesive bonding, thereby eliminating the reliability issues associated with adhesive degradation from temperature and humidity exposure.
Solution Approach 2:
The EMI shield is merged with the package body by forming it as an integral part of the mold cavity. This combining of the shield and package structure into a single molded component eliminates the need for separate attachment processes and adhesive materials, resolving the adhesion reliability problem while maintaining EMI shielding effectiveness.
2Object-affected harmful factors
If a conductive casing is secured to the package exterior, then EMI shielding is provided, but precise matching of sizes and shapes is required, increasing manufacturing cost and time
Solution Approach 1:
The EMI shield and package body are merged into a single molded component through direct integration in the mold cavity. This eliminates the need for separate casing components that require precise size and shape matching, thereby simplifying manufacturing and reducing costs while maintaining effective EMI shielding.
Solution Approach 2:
The mold cavity is designed to accommodate different package configurations, allowing the same basic shielding structure to be adapted for various package sizes and shapes. This universal approach eliminates the need for multiple specialized casings, reducing manufacturing complexity and cost.
3Object-affected harmful factors
If different package sizes and shapes require different casings, then EMI shielding is optimized for each package type, but manufacturing cost and time increase
Solution Approach 1:
The molding process is designed to accommodate different package types using a universal approach. The EMI shield is formed as an integral part of the package structure during molding, allowing adaptation to various package sizes and shapes without requiring different specialized casings, thereby maintaining EMI shielding effectiveness while improving manufacturing efficiency.
Solution Approach 2:
The EMI shield structure is designed with adjustable parameters that can be modified during the molding process to accommodate different package sizes and shapes. By changing geometric parameters rather than using entirely different casings, the system maintains optimal EMI shielding while simplifying manufacturing and reducing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI by grounding electromagnetic emissions, enhances reliability against environmental conditions, and simplifies manufacturing by eliminating the need for precise size and shape matching, thereby reducing costs and time in producing semiconductor device packages.
Implementation Method 1
an electromagnetic interference shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the connection surface of the grounding element
Implementation Method 2
the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the electromagnetic interference shield
Data Source
AI summary
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit defining a cut-out portion disposed adjacent to a periphery of the substrate unit; (2) a grounding element disposed in the cut-out portion and at least partially extending between an upper surface and a lower surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device and the grounding element; and (5) an EMI shield disposed adjacent to exterior surfaces of the package body. The EMI shield is electrically connected to a connection surface of the grounding element, such that the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.