EMI Shield Grounding via Substrate Connection
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Solution Overview
Problem
Semiconductor device packages face challenges with electromagnetic interference (EMI) due to increased clock speeds and smaller sizes, which lead to higher electromagnetic emissions, and existing shielding solutions, such as conductive casings, are prone to peeling and require precise matching, increasing manufacturing costs and time.
Innovation Solution
A semiconductor device package design featuring a substrate unit with grounding elements and an EMI shield that is electrically connected, allowing for efficient grounding of electromagnetic emissions without the need for adhesives and accommodating various package sizes and shapes, reducing manufacturing complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electrically conductive casing is used to shield semiconductor devices, then electromagnetic interference is reduced, but the casing is prone to peeling or falling off due to adhesive degradation from temperature and humidity
Solution Approach 1:
The EMI shield is integrated with the substrate unit through direct electrical connection via grounding elements, eliminating the need for separate adhesive bonding. The shield becomes part of the substrate structure, providing both EMI shielding and mechanical stability without relying on temperature-sensitive adhesives.
Solution Approach 2:
Grounding elements disposed adjacent to the periphery of the substrate unit serve as intermediaries to electrically connect the EMI shield to the substrate unit, providing a reliable electrical pathway for grounding electromagnetic emissions without requiring mechanical adhesive bonding.
2Object-affected harmful factors
If an electrically conductive casing is used to shield semiconductor devices, then electromagnetic interference is reduced, but precise matching of size and shape between casing and package is required, increasing manufacturing cost and time
Solution Approach 1:
The EMI shield is designed to be disposed adjacent to the exterior surfaces of the package body with electrical connection to the substrate unit, creating a universal shielding solution that can accommodate different package sizes and shapes without requiring custom-matched casings for each package type.
Solution Approach 2:
The EMI shielding function is segmented from the traditional integrated casing approach and implemented as a separate component that can be independently positioned and electrically connected to the substrate unit, allowing flexibility in accommodating different package configurations.
3Object-affected harmful factors
If different casings are used for semiconductor packages of different sizes and shapes, then each package is properly shielded, but manufacturing cost and time increase to accommodate the different casings
Solution Approach 1:
The EMI shield design with electrical connection to the substrate unit creates a universal shielding approach that can be applied to packages of various sizes and shapes, eliminating the need to manufacture different casings for different package types and thereby improving manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI by providing a reliable and adaptable shielding mechanism that maintains package stability across different environmental conditions and package configurations, enhancing manufacturing efficiency and reducing costs.
Implementation Method 1
the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield
Implementation Method 2
shielding can be accomplished by including an electrically conductive casing or housing that is electrically grounded and is secured to an exterior of the package
Data Source
AI summary
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.