Integrated EMI Shield Heat Sink for PCB Thermal Management

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Solution Overview

Problem

Conventional electronics system designs face inefficiencies in combining effective EMI shielding with adequate heat sinking for IC packages, often requiring larger, costlier heat spreaders or thermally resistive interfaces that hinder heat transfer.

Innovation Solution

An integrated circuit package is enclosed by an EMI shield ring capped with a heat sink lid, providing both effective EMI shielding and improved heat sinking through a single interface, enhancing thermal performance while maintaining cost efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If an external heat sink is mounted underneath the EMI shield, then thermal performance is improved, but EMI shield dimensions must be enlarged excessively to fit the heat sink

Engineering Contradiction:

Improvethermal performanceVSAvoidEMI shield dimensions

Core Design Contradiction:

TemperatureVSVolume of stationary object

Solution Approach 1:

The patent merges the EMI shield and heat sink into a single integrated component. The EMI shield body includes an integrated heat sink with fin structures that extend from the shield body, eliminating the need for separate heat sink components and excessive EMI shield enlargement while achieving both EMI shielding and heat dissipation functions simultaneously

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The EMI shield is designed to perform multiple functions: electromagnetic interference shielding and heat dissipation. The integrated heat sink structures (fins, channels) are incorporated directly into the EMI shield body, allowing it to serve as both a protective shield and a thermal management component

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Volume of stationary object

If a large heat spreader is integrated into the product enclosure, then EMI shield size is maintained small, but heat spreader area and cost increase significantly

Engineering Contradiction:

ImproveEMI shield sizeVSAvoidheat spreader area

Core Design Contradiction:

Volume of stationary objectVSArea of stationary object

Solution Approach 1:

Instead of using a large heat spreader across the entire enclosure, the patent implements localized heat sink structures (fins and channels) directly on the EMI shield body surrounding the IC package. This concentrates thermal management resources where they are most needed, reducing overall heat spreader area while maintaining effective heat dissipation

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If the heat sink is mounted above the EMI shield, then cost is minimized with nominal-sized components, but thermal performance deteriorates due to multiple thermally resistive interfaces

Engineering Contradiction:

ImprovecostVSAvoidthermal performance

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The EMI shield and heat sink are merged into a single monolithic or closely integrated structure, eliminating multiple separate components and their associated thermally resistive interfaces. The integrated design reduces thermal resistance pathways while maintaining cost-effectiveness through simplified manufacturing and assembly

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces the temperature of IC packages by increasing heat transfer efficiency with a single interface, offering improved thermal management and cost-effective solutions compared to conventional methods.

Implementation Method 1

Heat sink lids configured to transfer heat from integrated circuit (IC) packages to ambient environments

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a plurality of fins extending from a second surface... configured to transfer heat from the integrated circuit (IC) packages to the ambient environments

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

an EMI shield ring capped with a heat sink lid, providing both effective EMI shielding

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS8213180B2Electromagnetic interference shield with integrated heat sink

Publication Date: 2012.07.03 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LTD

AI summary

A printed circuit board (PCB) assembly is provided that includes a PCB, an integrated circuit package, an electromagnetic interference (EMI) shield ring, and a heat sink lid. A first surface of the package is mounted to a first surface of the PCB. The EMI shield ring is mounted to the first surface of the PCB in a ring around the package. A first surface of the heat sink lid includes a recessed region and first and second supporting portions separated by the recessed region. The heat sink lid is mated with the EMI shield ring such that the package is positioned in an enclosure formed by the EMI shield ring and the recessed region of the heat sink lid. A second surface of the package may interface with a surface of the recessed region.