Thermally Conductive EMI Shield Enclosure for Low-Z PCB Layouts
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Solution Overview
Problem
Legacy EMI shielding solutions for PCBs increase Z-height and consume valuable surface area, leading to inefficiencies and high costs, especially in mobile computing devices with integrated radio antennas.
Innovation Solution
A thermally conductive EMI shielding enclosure with walls extending from a planar top to the bottom surface of the PCB, providing a full Faraday cage effect without consuming surface area, using EMI walls and a gasket for comprehensive shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If legacy EMI shielding solutions are used, then EMI shielding is provided, but Z-height increases and surface area is consumed
Solution Approach 1:
The patent transitions from traditional planar EMI shielding approaches to a three-dimensional enclosure structure with vertical walls extending from the PCB surface. This dimensional change allows the shield to block EMI paths in the vertical dimension without consuming additional horizontal surface area, effectively resolving the contradiction between providing comprehensive EMI shielding and maintaining compact form factor.
Solution Approach 2:
The EMI shielding enclosure is integrated directly into the PCB structure, with the shield enclosure nesting around components on the PCB surface. The vertical walls are formed as part of the PCB layer structure, eliminating the need for separate shielding components and reducing overall Z-height while maintaining effective shielding coverage.
2Object-affected harmful factors
If legacy EMI shielding solutions are used, then EMI shielding is provided, but valuable PCB surface real estate is occupied
Solution Approach 1:
The patent utilizes the vertical dimension by extending shield walls upward from the PCB surface rather than expanding horizontally across the PCB surface. This allows comprehensive EMI shielding coverage without occupying additional valuable PCB real estate, as the shielding structure occupies the vertical space above existing components rather than requiring additional component placement area.
3Object-affected harmful factors
If EMI shielding structures are added, then EMI protection is improved, but thermal management capability deteriorates
Solution Approach 1:
The shield enclosure structure serves dual functions: providing EMI shielding through its conductive walls while simultaneously acting as a thermal management solution. The same vertical walls that block electromagnetic interference also serve as heat dissipation pathways, conducting heat away from protected components through thermally conductive materials integrated into the shield structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces Z-height, maintains cooling space, and provides effective EMI shielding without occupying PCB surface area, enhancing computing performance and radio connectivity in mobile devices.
Implementation Method 1
the planar top and the one or more walls include material that is thermally conductive
Implementation Method 2
forming a Faraday cage without consuming any surface area, using a top EMI shield and EMI gasket to provide comprehensive EMI shielding
Data Source
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AI summary
Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.