EMI Shield Housing Under Memory Modules on Compact PCBs
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Solution Overview
Problem
Designing effective EMI shields for memory modules in compact electronic devices is challenging due to space constraints, leading to compromises between EMI shielding efficiency and PCB size, as traditional solutions either interfere with other components or require larger PCBs.
Innovation Solution
The development of extended EMI shields that wrap underneath memory modules, allowing ground contacts and plated through holes to be positioned optimally without shifting the modules, thus maintaining EMI shielding efficiency while reducing PCB size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional EMI shields are used with ground contacts and vias positioned close to memory modules, then EMI shielding efficiency is maintained, but the shields interfere with other components on the PCB due to space constraints
Solution Approach 1:
The EMI shield extends in the vertical dimension underneath the memory module, utilizing the z-axis space rather than only the planar x-y dimensions. This allows ground contacts to be positioned on the bottom surface of the PCB away from other components while maintaining shielding effectiveness through the extended enclosure.
2Area of stationary object
If PCB size is reduced to meet space constraints, then device compactness is improved, but EMI shielding effectiveness is compromised
Solution Approach 1:
By extending the EMI shield underneath the memory module into the vertical dimension, the design maintains effective EMI enclosure on a compact PCB. The extension provides additional ground contact area and shielding coverage without increasing the PCB footprint.
3Adaptability or versatility
If ground contacts are positioned farther from memory modules, then interference with other components is reduced, but EMI shielding efficiency decreases
Solution Approach 1:
The shield extension creates a three-dimensional enclosure that maintains EMI shielding effectiveness even when ground contacts are positioned farther from the memory module in the planar dimensions. The vertical extension compensates for the increased distance by providing additional shielding pathways.
Solution Approach 2:
The EMI shield structure is nested underneath the memory module, with the shield extension fitting into the vertical space beneath the module. This nested configuration allows ground contacts to be positioned away from other components while maintaining close electromagnetic coupling for effective shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables smaller PCBs without sacrificing EMI shielding, provides cost-effective and sustainable shielding, and allows for easier module upgrades, benefiting devices with small form factors.
Implementation Method 1
Electromagnetic interference (EMI) shields are crucial for protecting electronic components, such as memory modules, from EMI
Data Source
AI summary
Devices and systems for shielding electromagnetic interference, and methods of forming the same, are disclosed herein. In one example, an electromagnetic interference (EMI) shield includes a housing to substantially enclose a memory module. When the housing and the memory module are coupled to a circuit board, the housing is to extend at least partially underneath the memory module. The housing may also be openable or at least partially removable.