EMI Shield Heat Sink With Folds And Nested Structure
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Solution Overview
Problem
Conventional electromagnetic interference (EMI) shields have limited heat dissipating capacity due to restricted size and area, which can lead to thermal damage in electronic components.
Innovation Solution
An EMI shield configuration featuring a housing with a peripheral flange, a base heat sink, and additional heat sinks with folds to increase surface area, anchored by a conductive member with a bulge and fastener, allowing for enhanced thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the size and area of the heat sink are increased to improve heat dissipation, then the heat dissipating effect is enhanced, but the volume and area of the EMI shield are limited and cannot be suitably increased
Solution Approach 1:
The patent applies nesting by attaching an additional heat sink onto the existing base heat sink, creating a hierarchical structure where one heat dissipation component is nested within another. This allows the system to achieve greater effective heat dissipation surface area without proportionally increasing the overall EMI shield volume, as the second heat sink utilizes the vertical space above the base heat sink rather than requiring additional lateral space.
Solution Approach 2:
The patent transitions from a two-dimensional heat dissipation approach (single heat sink surface area) to a three-dimensional approach by stacking multiple heat sinks vertically. This dimensional change allows the system to increase heat dissipation capacity without linearly increasing the lateral footprint or overall volume of the EMI shield structure.
2Temperature
If a base heat sink is attached to the housing, then heat dissipation is improved, but the surface area remains limited without additional structures
Solution Approach 1:
The patent combines multiple heat dissipation functions into a single integrated structure by attaching a second heat sink to the base heat sink. This merging of heat dissipation surfaces creates a unified thermal management system that achieves greater total surface area for heat dissipation while maintaining structural cohesion within the EMI shield housing.
Solution Approach 2:
The additional heat sink is nested onto the base heat sink, creating a multi-layered heat dissipation structure. This nesting arrangement effectively multiplies the available heat dissipating surface area within the constrained volume of the EMI shield, allowing thermal energy to be dissipated across multiple surfaces rather than a single limited area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration significantly enhances the heat dissipating effect by increasing the surface area of the heat sinks, effectively managing thermal energy and preventing damage to electronic components.
Implementation Method 1
Heat sinks are generally die cast articles manufactured from a material having a high thermal conductivity, such as aluminum
Implementation Method 2
Air flow through the heat dissipating elements, with or without the assistance of a mechanical fan, operates to dissipate the thermal energy from the heat sink
Implementation Method 3
a conductive member engaged with the peripheral flange of the housing
Implementation Method 4
the conductive member includes a fastener engaged through the opening of the housing and engaged with the aperture of the base heat sink
Data Source
AI summary
An electromagnetic interference shield includes a housing having an opening formed by a peripheral flange, and a base heat sink engaged onto the housing, the base heat sink includes an aperture formed the base heat sink and includes one or more folds for increasing a surface size of the base heat sink, a conductive member is engaged with the peripheral flange of the housing, and the conductive member includes a fastener engaged through the opening of the housing and engaged with the aperture of the base heat sink, and one or more heat sinks are further attached onto the base heat sink for increasing a surface size of the heat sinks.