EMI Shield Recessed Dielectric Under-Shield Space
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Solution Overview
Problem
Existing EMI shields often lack sufficient under-shield space and component clearance, leading to potential electrical shorting and inadequate EMI/RFI shielding, which can cause signal degradation or equipment failure.
Innovation Solution
The development of EMI shields with recessed portions on their inner surfaces, filled with dielectric material, which provides increased under-shield space and clearance for components, preventing electrical shorting and enhancing EMI shielding by using ultraviolet-curable dielectric coatings that offer high electrical resistance and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If EMI shields are designed with standard flat inner surfaces, then manufacturing is simple and cost-effective, but under-shield space is insufficient and components may experience electrical shorting
Solution Approach 1:
The inner surface of the EMI shield is segmented into multiple recessed portions (first, second, third recessed portions) at different locations. These recesses create distinct compartments that increase under-shield space for components while maintaining a relatively simple overall shield structure. The segmentation allows components to be positioned in isolated zones with improved clearance.
Solution Approach 2:
Dielectric material is applied locally within the recessed portions rather than uniformly across the entire inner surface. This local quality approach provides electrical isolation and increased clearance exactly where components are positioned, while leaving other areas of the shield simpler and more cost-effective to manufacture.
2Reliability
If dielectric material is applied to the inner surface of EMI shields, then electrical isolation and prevention of shorting is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The dielectric material is applied to the inner surface of the EMI shield before the shield is assembled with the housing and components. This preliminary action ensures that the dielectric coating is in place to prevent electrical shorting before components are installed, simplifying the overall manufacturing process by combining multiple steps into a sequential workflow.
Solution Approach 2:
The dielectric material serves as an intermediary layer between the conductive EMI shield and the components positioned against it. This intermediate layer provides the necessary electrical isolation to prevent shorting while allowing the shield to maintain its EMI shielding function, effectively mediating between the conductive shield and sensitive components.
3Length of stationary object
If recessed portions are created in the EMI shield inner surface, then component clearance is increased, but manufacturing precision requirements increase
Solution Approach 1:
The recessed portions are designed with depths and dimensions that provide sufficient clearance for components without requiring extremely tight tolerances. By creating partial recesses rather than deep cavities, the design achieves the necessary component clearance while maintaining reasonable manufacturing precision requirements that are consistent with standard fabrication capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases under-shield space and component clearance, preventing electrical shorting and improving EMI shielding efficiency while withstanding high temperatures, thus enhancing the reliability and performance of electronic devices.
Implementation Method 1
providing an ultraviolet (UV) curable dielectric material along a portion of an EMI shield and curing the dielectric material through exposure to UV
Implementation Method 2
shields capable of absorbing and/or reflecting and/or redirecting EMI energy
Data Source
AI summary
According to various aspects, exemplary embodiments are disclosed of EMI shields with increased under-shield space and/or greater component clearance for one or more components under the shield. In an exemplary embodiment, a shield generally includes one or more recessed portions along an inner surface of the cover. Dielectric material is along the inner surface of the cover within at least the one or more recessed portions. The one or more recessed portions may provide increased under-shield space and/or greater clearance for one or more components under the shield. The dielectric material may inhibit the one or more recessed portions of the shield from directly contacting and electrically shorting one or more components when the one or more components are under the shield. Also disclosed are exemplary embodiments of methods relating to making EMI shields and methods relating to providing shielding for one or more components on a substrate.