EMI Shield Structure for Semiconductor Packages
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Solution Overview
Problem
Conventional electromagnetic interference (EMI) shielding methods for semiconductor packages do not completely prevent electromagnetic wave interference, leading to malfunction in adjacent semiconductor devices.
Innovation Solution
An electronic apparatus with a conductive EMI shield structure that includes a lower conductive shield member extending along the perimeter of the gap between the semiconductor package and the main board, and an upper conductive shield member on the semiconductor package, both electrically connected to ground pads to enhance shielding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional EMI shielding methods are used, then some electromagnetic wave emission is reduced, but complete shielding is not achieved and adjacent semiconductor devices may still malfunction
Solution Approach 1:
The EMI shield structure is divided into multiple segments: a first EMI shield member positioned at the bottom of the gap between the semiconductor package and main board, and a second EMI shield member positioned at the top of the gap. This segmentation allows each shield member to independently address electromagnetic interference from different directions, achieving complete shielding while maintaining proper device operation
Solution Approach 2:
The EMI shielding is extended into the vertical dimension by placing shield members at both the bottom and top of the gap between the semiconductor package and main board. This three-dimensional arrangement creates a complete shielding enclosure that blocks electromagnetic waves from propagating in multiple directions, preventing adjacent device malfunction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively seals the semiconductor package and the space between it and the main board, significantly reducing electromagnetic wave emission and enhancing EMI shielding, thereby preventing device malfunction.
Implementation Method 1
a conductive electromagnetic interference shield structure configured to shield the semiconductor package and the space between the semiconductor package and the main board from electromagnetic interference
Data Source
AI summary
An electronic apparatus includes a main board, a semiconductor package, an upper conductive EMI shield member, and a lower conductive EMI shield member. The main board includes a first ground pad. The semiconductor package is spaced apart from and electrically connected to the main board. The upper conductive EMI shield member covers a top surface and a sidewall of the semiconductor package. The lower conductive EMI shield member surrounds a space between the main board and the semiconductor package, and is electrically connected to the upper conductive EMI shield member and the first ground pad.