Single-Piece EMI Shield With Snap Latch Mechanism
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Solution Overview
Problem
Existing board-level shields for electronic components on printed circuit boards require multiple pieces and complex assembly processes, leading to increased costs, installation time, and reduced EMI shielding effectiveness due to the need for separate covers and frames.
Innovation Solution
A single-piece construction board-level shield with a snap latch mechanism that allows the cover to be repeatedly removed and reattached, using interlocking members and scored geometry to maintain EMI shielding performance without additional material or size, and can be installed without tools or mechanical fasteners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple pieces and complex assembly processes are used for board-level shields, then EMI shielding effectiveness can be achieved, but manufacturing cost, installation time, and device complexity increase
Solution Approach 1:
The patent merges the shield body and cover into a single integrated piece, eliminating the need for separate components and complex assembly processes. The snap latch mechanism is integrally formed with the shield body, allowing the cover to be repeatedly attached and detached without requiring additional fasteners or complex assembly steps, thus reducing device complexity while maintaining EMI shielding effectiveness
Solution Approach 2:
The patent segments the shield into a removable cover portion and a base portion that can be separately installed on the PCB, allowing for simplified assembly. The snap latch mechanism enables the cover to be easily removed and reattached without complex fastening procedures, reducing both manufacturing and installation complexity
2Reliability
If multiple pieces and complex assembly processes are used for board-level shields, then EMI shielding effectiveness can be achieved, but manufacturing cost and installation time increase
Solution Approach 1:
The integrated design combines the shield body and cover into one piece with built-in snap latch mechanisms, eliminating multiple assembly steps. The cover can be directly installed onto the shield body without requiring separate fastening operations, significantly reducing installation time while maintaining effective EMI shielding
Solution Approach 2:
The snap latch mechanism is designed to be self-aligning and self-latching, requiring no additional tools or complex manipulation during installation. The interlocking members automatically engage when the cover is positioned over the base portion, enabling rapid tool-free installation and reducing time loss
3Object-affected harmful factors
If separate covers and frames are used for shields, then EMI shielding can be provided, but material cost and assembly complexity increase
Solution Approach 1:
The patent combines the shield body and cover into a single integrated piece, reducing the total quantity of materials required. The snap latch mechanism is formed as an integral part of the shield body rather than requiring separate components, eliminating additional material usage while maintaining effective EMI shielding performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces material and labor costs, simplifies installation, and maintains effective EMI shielding performance, with demonstrated attenuation of EMI radiation by 30-40 decibels across various frequencies.
Implementation Method 1
The first interlocking member is integrally defined by the one or more of upper sidewall portion, and downwardly depends relative to the upper surface. The second interlocking member is integrally defined by one or more of the lower sidewall portions, and upwardly protrudes relative to the upper surface. The opening accommodates movement of the first interlocking member inwardly relative to the opening, thereby allowing continued respective upward or downward movement of the first interlocking member relative to the second interlocking member for engaging or disengaging the snap latch mechanism.
Implementation Method 2
electrically conducting (and sometimes magnetically conducting) material is interposed between the two portions of the electronic circuitry for absorbing and/or reflecting EMI energy
Implementation Method 3
electrically conducting (and sometimes magnetically conducting) material is interposed between the two portions of the electronic circuitry for absorbing and/or reflecting EMI energy
Data Source
AI summary
According to various aspects, exemplary embodiments are provided of board level shields having single piece constructions. In an exemplary embodiment, a shielding enclosure includes sidewalls and an integral top surface. The sidewalls include upper and lower portions cooperatively defining an interlock therebetween. The upper sidewall portions depend downwardly from the integral top surface. The interlock releasably attaches the integral top surface and upper sidewall portions to the lower sidewall portions. By disengaging the interlock, the integral top surface and upper sidewall portions may then be completely separated from the lower sidewall portions. The integral top surface and upper sidewall portions may also be reattached to the lower sidewall portions by engagement of the interlock.