Board-Level EMI Shield with Thermal Conductive Gasket

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Solution Overview

Problem

Electronic equipment faces inefficiencies and potential failure due to electromagnetic interference (EMI) and heat buildup from board-mounted electrical components, which existing shielding and thermal management solutions fail to adequately address simultaneously.

Innovation Solution

The implementation of a board-level EMI shielding apparatus with resiliently compressible EMI gaskets and thermally-conductive materials that form a heat path from electrical components to the shield, allowing for both EMI shielding and thermal dissipation through a single-component solution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If separate EMI shields and thermal management components are used, then EMI shielding effectiveness is improved, but device complexity and assembly steps increase

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoidassembly complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent combines EMI shielding functionality and thermal management functionality into a single integrated component. The EMI shield incorporates thermally-conductive material that直接接触 (directly contacts) the electrical component, eliminating the need for separate thermal management components and reducing assembly complexity while maintaining both EMI shielding and heat dissipation effectiveness

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The EMI shield is designed to perform multiple functions simultaneously: it provides electromagnetic interference shielding and acts as a thermal management component through its thermally-conductive material. This multi-functional design reduces the number of components needed and simplifies the overall assembly process

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Object-affected harmful factors

If resiliently compressible EMI gaskets are used, then EMI shielding effectiveness is improved, but thermal conduction efficiency deteriorates

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoidthermal conduction efficiency

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent applies different material properties to different regions of the EMI shield. The portions contacting the electrical component use thermally-conductive material for efficient heat transfer, while other portions maintain resiliently compressible EMI gasket material for effective electromagnetic shielding. This localized differentiation resolves the contradiction between EMI shielding and thermal conduction

Inventive Principle:

Principle #3Local quality

3Object-affected harmful factors

If multiple separate components are used for EMI shielding and thermal management, then each function is optimized, but manufacturing cost and assembly time increase

Engineering Contradiction:

ImproveEMI shielding and thermal management effectivenessVSAvoidassembly speed

Core Design Contradiction:

Object-affected harmful factorsVSProductivity

Solution Approach 1:

By merging EMI shielding and thermal management into a single integrated component, the patent reduces the number of parts that need to be manufactured, stored, and assembled. This single-component solution improves manufacturing efficiency and assembly speed while maintaining both EMI shielding and thermal management effectiveness

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces EMI and heat buildup, enhancing the reliability and lifespan of electronic equipment by providing comprehensive shielding and thermal management in a compact, integrated design.

Implementation Method 1

At least one thermally-conductive compliant material is disposed for forming a thermally-conducting heat path from the one or more electrical components to the board level shield

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

at least one resiliently compressible EMI gasket disposed along at least a portion of the board level shield

Methodology Applied

Scientific EffectElectromagnetic shielding: Absorption (EM radiation)

Data Source

PatentUS20070209833A1Combined board level EMI shielding and thermal management

Publication Date: 2007.09.13 LAIRD TECHNOLOGIES INC

AI summary

According to various aspects of the present disclosure, exemplary embodiments are provided of EMI shielding apparatus capable of providing board level EMI shielding for one or more electronic components while also providing dissipation of heat generated by the one or more electronic components. In one particular embodiment, an apparatus generally includes a board level shield having at least one resiliently compressible EMI gasket disposed along at least a portion of the board level shield. At least one thermally-conductive compliant material is disposed relative to an inner surface of the board level shield and to the one or more electrical components. The at least one thermally-conductive material can form a thermally-conducting heat path from the one or more electrical components to the board level shield.