EMI Shield Thermal Path for Handheld Device Heat Dissipation
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Solution Overview
Problem
Conventional handheld electronic devices face challenges in dissipating heat effectively from heat-generating components to the external casing due to the placement of the battery above the board level shield (BLS), which obstructs a direct thermally-conductive heat path, potentially leading to elevated operating temperatures and reduced device performance.
Innovation Solution
The use of a thermally-conductive heat path formed by an electromagnetic interference (EMI) shield and/or thermal interface material (TIM) disposed around the battery area, allowing heat to be transferred from heat-generating components on the circuit board to the external casing, either directly or through multiple stages involving the shield and TIMs, thereby bypassing the traditional obstruction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the battery is placed above the board level shield (BLS), then the battery area is properly shielded from electromagnetic interference, but a direct thermally-conductive heat path from heat-generating components to the external casing is obstructed
Solution Approach 1:
The patent introduces a thermally-conductive adhesive as an intermediary material between the BLS and the heat-generating components. This adhesive serves as a mediator that maintains the EMI shielding function of the BLS while simultaneously providing a thermally-conductive path to transfer heat from the components to the BLS and eventually to the external casing, thus resolving the contradiction between shielding effectiveness and heat dissipation.
2Temperature
If a thermally-conductive path is established around the battery area through the shield, then heat dissipation is improved, but the device complexity increases due to additional thermal interface materials and path configurations
Solution Approach 1:
The patent makes the BLS serve multiple functions: it continues to provide EMI shielding for the battery area while simultaneously acting as a thermal conduction path for heat dissipation. The thermally-conductive adhesive also serves dual purposes by both bonding the BLS to the components and providing thermal conduction. This multi-functionality reduces the need for separate dedicated thermal management components, thereby improving heat dissipation without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables improved heat dissipation, reducing the maximum external casing temperature and enhancing thermal performance by establishing a direct and efficient thermally-conductive path from heat sources to the ambient environment, thus preventing damage to components and maintaining optimal operating conditions.
Implementation Method 1
a thermally-conductive heat path that includes or is formed by one or more portions of an electromagnetic interference (EMI) board level shield (BLS) and/or thermal interface material (TIM)
Data Source
AI summary
According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material.