EMI-Shielded Chassis for High-Density Data Processing Frames
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Solution Overview
Problem
High-density environments face challenges with thermal management, mechanical positioning, and electrical concerns due to electromagnetic interference (EMI) from tightly packed devices, which existing technologies fail to effectively mitigate.
Innovation Solution
A data processing device with an internal volume and frame mountable chassis that suppresses EMI by greater than 80 decibels, allowing for the inclusion of EMI emitting devices while maintaining ambient environment isolation, and a method for managing EMI by terminating, replacing, and re-enabling devices within the EMI suppressed state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If devices are tightly packed together in high-density environments, then device density and space utilization are improved, but electromagnetic interference between devices increases
Solution Approach 1:
The device is divided into separate functional modules: an EMI-emitting module and an EMI-sensitive module, physically separated within the device housing. This segmentation allows each module to be optimized independently - the emitting module can generate necessary electromagnetic signals while the sensitive module is protected from interference through spatial separation and targeted shielding.
Solution Approach 2:
The EMI-shielding function is extracted as a separate component system rather than being integrated into every individual component. Shielding structures are implemented as distinct elements (such as conductive enclosures or屏蔽 plates) that can be selectively applied around specific EMI-sensitive components or modules, reducing overall device complexity while maintaining protection.
2Object-generated harmful factors
If EMI shielding structures are added to suppress electromagnetic interference, then EMI suppression performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The shielding structures are designed to serve multiple functions simultaneously: they provide EMI suppression, act as mechanical support structures for mounting components, and serve as thermal management pathways. This multi-functionality reduces the total number of separate components needed, simplifying the overall device structure while maintaining effective EMI protection.
Solution Approach 2:
The patent employs thin conductive shielding films and flexible shielding structures that can be easily integrated into the device assembly process. These thin-film shields are simpler to manufacture and install compared to bulky traditional shielding enclosures, reducing manufacturing complexity while providing effective EMI suppression through their conductive properties.
3Object-generated harmful factors
If EMI shielding structures are added to suppress electromagnetic interference, then EMI suppression performance is improved, but manufacturing cost and ease of manufacture deteriorate
Solution Approach 1:
The shielding structures are merged with existing device components such as housing parts, circuit board ground planes, and connector shields. By combining EMI suppression functionality with components that already exist in the device design, the patent avoids adding separate manufacturing steps and reduces overall manufacturing complexity and cost.
Solution Approach 2:
The patent utilizes changes in material properties and geometric parameters of existing components to provide EMI suppression. For example, modifying the thickness, conductivity, or shape of existing metal parts or circuit board traces can provide shielding without requiring additional manufacturing processes, thereby maintaining ease of manufacture while achieving EMI suppression.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively isolates EMI from the ambient environment, facilitating the use of EMI emitting devices in high-density settings without negatively impacting the environment, while enabling the insertion, removal, and modification of devices while maintaining isolation.
Implementation Method 1
a frame mountable chassis adapted to suppress EMI from the internal volume to an ambient environment by greater than 80 decibels
Data Source
AI summary
A system for providing electromagnetic interference (EMI) suppression for data processing devices includes a frame adapted to receive a data processing device of the data processing devices. The system further includes the data processing device that includes a payload module adapted to suppress EMI from an internal volume to an ambient environment by greater than 80 decibels. The data processing device further includes the internal volume adapted to house EMI emitting devices that generate EMI.